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AI glasses are rapidly driving new demand in the wearable market. Major international companies like Meta and Apple are accelerating their product launches, and several startups in China are also entering the fray. The supply chain for AI glasses, including sensing and lens modules, is generating new momentum and benefiting HDI, flexible circuit board, rigid-flex board, and substrate manufacturers, making AI glasses a focal point in the wearable device sector.   Huatong currently focuses on mid to high-end HDI boards for AI glasses applications and is simultaneously developing flexible and rigid-flex boards, creating a complete product lineup. Although current shipments have not significantly contributed to revenue, growth is evident, and the company has entered stable mass production. Clients include several international brands like Meta, and many startups in China are actively developing AI glasses. The lightweight and compact nature of AI glasses increases the demand for high-end printed circuit boards, which is advantageous for the company to expand its share of high-end applications.   Zhen Ding is one of the earliest PCB manufacturers to enter the smart glasses field, now offering a complete product line that includes flexible boards, SiP modules, and rigid boards. Zhen Ding reports that its global market share for printed circuit boards used in smart glasses has reached 30-50%. Although this year's shipments have not peaked, the scale has grown several times compared to last year. With high technical barriers and premium pricing, the gross margin for this business is already above the company’s overall average and is expected to continue improving profitability.   Taiwan's Jeng Yi has been actively entering the wearable device market in recent years, and its new generation of products for AI glasses has completed mass production introduction, with initial results gradually emerging. The company estimates that shipments will grow significantly in 2026, further boosting operational momentum.   In upstream materials, PI manufacturer Damao is targeting Meta glasses with transparent PI. Damao provides films, while its subsidiary Bo Mi Lan specializes in fine circuits, enabling smart glasses to achieve eye-tracking functionality. The company plans to continue its strategic positioning in the AI glasses market.   ------------------------------------ Source: Money DJ Disclaimer: We respect originality and focus on sharing. The text and images are copyrighted by the original authors. The purpose of reprinting is to share more information and does not represent our position. If your rights are infringed, please contact us promptly, and we will delete it immediately. Thank you.

The rising popularity of RO4003C PCBs has become evident, particularly in high-frequency and performance-sensitive applications. 1. Superior Electrical Performance Customers favor RO4003C PCBs primarily due to their outstanding electrical characteristics. With a dielectric constant (DK) of 3.38 +/- 0.05 at 10 GHz, these materials deliver exceptional signal integrity, which is critical for RF and microwave applications. The low dissipation factor (0.0027 at 10 GHz) further enhances performance by minimizing signal loss. 2. Cost-Effective Manufacturing RO4003C materials can be processed similarly to traditional FR-4, resulting in reduced manufacturing costs without sacrificing quality. This cost-effectiveness makes them appealing for high-volume production, allowing customers to stay within budget while achieving high performance. 3. Excellent Thermal Stability The thermal coefficient of expansion (CTE) of RO4003C closely matches that of copper, ensuring excellent dimensional stability. This characteristic helps mitigate issues related to thermal expansion, ensuring reliable performance even under varying temperature conditions. Additionally, the high glass transition temperature (Tg) of over 280°C supports reliability in demanding environments.     4. Versatility in Applications RO4003C PCBs are highly versatile, suitable for a range of applications including:   Cellular base station antennas RF identification tags Automotive radar systems LNBs for direct broadcast satellites   This adaptability makes them attractive to customers in various industries seeking dependable solutions. 5. Reduced Need for Special Handling Unlike PTFE-based materials, RO4003C does not require special through-hole treatments or handling procedures. This ease of use simplifies the manufacturing process and minimizes the risk of errors, making them a preferred choice for designers. 6. Low Moisture Absorption With a moisture absorption rate of just 0.06%, RO4003C PCBs are less susceptible to degradation in humid environments. This feature enhances their reliability and longevity, making them suitable for outdoor and harsh conditions. 7. Compliance with Industry Standards RO4003C PCBs typically adhere to IPC-Class-2 standards, ensuring they meet quality and reliability benchmarks. This compliance builds trust among customers who prioritize dependable electronic components. Conclusion The growing popularity of RO4003C PCBs among customers can be attributed to their superior electrical performance, cost-effectiveness, excellent thermal stability, versatility, and reduced handling requirements. These attributes position them as an ideal choice for a wide range of applications, solidifying their status as a preferred option in the PCB market.    

The United States has decided to impose a 50% tariff on copper starting August 1, putting the global semiconductor industry on high alert. Copper is a key material for high-performance semiconductors, electric vehicles, and traditional industries such as wiring. The surge in copper prices is directly impacting the global semiconductor supply chain and manufacturing costs. Additional tariffs on semiconductors are expected to be introduced by the end of this month, escalating tensions.   Industry insiders revealed on the 13th that South Korea's domestic semiconductor industry is planning tariff policy solutions and countermeasures. Finished semiconductor chips will not be subject to tariffs, but critical components required for chip production (such as copper wire) will be included in the tariff scope. This is likely to indirectly lead to an increase in semiconductor manufacturing costs.   Semiconductor industry experts stated, “The U.S. tariff on copper does not directly affect semiconductors themselves, but it will lead to a sharp increase in the cost of key materials, which will have a practical impact on semiconductor manufacturing.” They added, “The impact will be greater for high-performance semiconductors that use large amounts of copper.”   Traditionally, copper is widely used in electric vehicles, batteries, and wiring, but it is also crucial in semiconductor packaging, substrate design, and high-speed data transmission lines. As demand for advanced AI chips and high-performance GPUs increases for finer and more complex wiring structures, the use of copper is rising.   This situation is equally unwelcome for the U.S. semiconductor industry. Companies like Intel and Micron, which are aggressively expanding production in the U.S., are facing unexpected “raw material inflation.” If the copper tariff is implemented, import prices will rise nearly 1.5 times. The Semiconductor Industry Association (SIA) expressed concern, stating, “Contrary to the intention of protecting domestic industries, domestic chip production costs may rise rapidly, weakening global competitiveness.”   The issue is that the tariff policy for finished semiconductors has yet to be introduced. President Trump stated during a cabinet meeting at the White House on the 8th that, “We will announce tariffs on certain products like pharmaceuticals and semiconductors.” Although President Trump did not disclose specific tariff rates, announcement times, or implementation dates, Secretary of Commerce Howard Rutnik indicated after the cabinet meeting that the plan is to complete the investigation into semiconductors by the end of this month.   This tariff policy is interpreted as an attempt to ensure tax revenue and curb China's rise in the semiconductor industry, placing the entire semiconductor supply chain under the U.S.   The U.S. continues to pressure global semiconductor companies like TSMC, Samsung Electronics, and SK Hynix through tariff policies, demanding they establish production bases and invest in the U.S.   In particular, the U.S. domestic memory industry is expected to face pressure. Samsung Electronics is building a foundry in Taylor, Texas, while SK Hynix is preparing to establish a semiconductor packaging production base in Lafayette, Indiana. These two companies do not have memory production facilities in the U.S. If tariffs on semiconductors are imposed in the U.S., they will be able to establish memory production facilities.   However, some observers believe that imposing high tariffs on semiconductors in the U.S. is not an easy task. This is because countries and regions like South Korea and Taiwan dominate a large portion of the global semiconductor market, and excessive tariffs could actually drive up the prices of U.S. companies' products.   Senior researcher Kim Yang-pyeong from the Korea Industrial Research Institute cautiously predicts, “Given that Trump has mentioned semiconductors again, the likelihood of not imposing tariffs on semiconductors is high,” but also states, “The possibility of imposing high tariffs like those on copper is low.”   He analyzes, “For other products mentioned for tariffs, the U.S. has production or alternatives, but there are not many alternatives for semiconductors. Just like with iPhone tariffs, the U.S. cannot take forceful actions in areas that harm its own interests.”   Chips May Face Disruption from Copper Supply Issues   PricewaterhouseCoopers (PwC) recently reported that by 2035, about 32% of global semiconductor production may be affected by climate change-related copper supply disruptions, a figure that is four times the current level.   Chile, the world's largest copper producer, is already dealing with water shortages, which is slowing copper production. PwC states that by 2035, most of the 17 countries supplying copper to the chip industry will face drought risks.   The last global chip shortage stemmed from a dual impact of pandemic-induced demand surges and factory shutdowns, which severely impacted the automotive industry and caused production lines in other chip-dependent industries to stall.   Glenn Borm, a project leader at PwC, cited U.S. Department of Commerce data, stating, “This led to a full 1% decline in U.S. GDP growth, while Germany experienced a 2.4% decline.”   PwC indicates that copper miners from countries such as China, Australia, Peru, Brazil, the U.S., the Democratic Republic of Congo, Mexico, Zambia, and Mongolia will also be affected, and all chip manufacturing regions globally cannot avoid this risk.   Copper is used to make billions of tiny wires in each chip circuit. Although research is ongoing into alternative materials, none can currently match copper in terms of price and performance.   PwC warns that if material innovations do not adapt to climate change, and affected countries fail to develop more stable water supply systems, this risk will continue to escalate over time.   The report states, “By 2050, about half of each country's copper supply will face risks—regardless of how quickly global carbon emissions are reduced.”   Chile and Peru have taken measures to secure water supplies, including improving mining efficiency and constructing desalination plants. PwC states that this approach is exemplary, but may not be a solution for countries unable to access large amounts of seawater. PwC estimates that currently, 25% of Chile's copper production faces disruption risks, a figure that will rise to 75% within the next decade, reaching 90% to 100% by 2050.   --------------------------------------------- Source:  Statement: We respect originality and value sharing; the text and images are copyrighted by the original authors. The purpose of this repost is to share more information and does not represent our stance. If your rights are infringed, please contact us promptly, and we will delete the content immediately. Thank you.  

Polytetrafluoroethylene (PTFE) printed circuit boards (PCBs) have gained significant traction in the electronics industry, especially for high-frequency and microwave applications. Known for their unique properties, PTFE PCBs offer a range of advantages that make them an ideal choice for various demanding environments.   1. Low Dielectric Constant One of the standout features of PTFE PCBs is their low dielectric constant, typically ranging from 2.1 to 2.2. This property significantly reduces signal loss, making PTFE an excellent choice for high-frequency applications. By minimizing signal degradation, designers can achieve better signal integrity, which is crucial in applications like telecommunications and data transmission.   2. Low Loss Tangent In addition to a low dielectric constant, PTFE PCBs exhibit a low loss tangent, often less than 0.001. This characteristic ensures minimal energy loss during signal transmission, making PTFE ideal for RF and microwave circuits. The efficiency of signal propagation is essential for applications that require high precision and performance, such as radar systems and satellite communications.   3. High Thermal Stability PTFE is known for its exceptional thermal stability, with a thermal degradation temperature exceeding 300°C. This property allows PTFE PCBs to maintain their performance in high-power applications without compromising reliability. As electronic devices become more powerful, the ability to withstand higher temperatures becomes increasingly important, especially in sectors like automotive and aerospace.   4. Excellent Chemical Resistance Another significant advantage of PTFE is its resistance to a wide range of chemicals and environmental factors. This chemical inertness ensures durability and reliability in various applications, making PTFE PCBs suitable for harsh environments. Industries such as pharmaceuticals and chemical processing benefit greatly from this property, where equipment must withstand aggressive substances.   5. Good Mechanical Properties PTFE PCBs offer a combination of mechanical strength and flexibility, making them suitable for applications that require bending or dynamic movement. This flexibility is particularly beneficial in compact electronic devices where space is limited, allowing for innovative designs without sacrificing performance.   6. Low Moisture Absorption PTFE's low moisture absorption rate is crucial for maintaining stable electrical performance in varying humidity conditions. This property ensures that PTFE PCBs perform reliably in environments where moisture levels fluctuate, effectively reducing the risk of circuit failures.   7. Ease of Fabrication Modern manufacturing techniques allow for the easy processing of PTFE, enabling the production of complex PCB designs and multilayer configurations. This ease of fabrication makes PTFE an attractive option for engineers looking to create intricate circuits that meet specific performance requirements.   8. High Frequency Performance PTFE PCBs excel in high-frequency and microwave applications, maintaining their performance integrity even at elevated frequencies. This capability is vital for the development of advanced communication technologies, including 5G networks and IoT devices, where speed and efficiency are paramount.   9. Low Weight The lightweight nature of PTFE is an additional advantage, particularly in aerospace and portable electronic devices where weight reduction is crucial. Using PTFE PCBs can contribute to overall weight savings in complex systems, enhancing the efficiency and functionality of devices.   Conclusion The advantages of PTFE PCBs make them a preferred choice in various industries, including telecommunications, aerospace, automotive, and medical devices. Their unique properties, such as low dielectric constant, low loss tangent, thermal stability, and chemical resistance, ensure high performance and reliability in demanding applications. As technology continues to evolve, the role of PTFE PCBs will likely expand, paving the way for innovative solutions in the ever-advancing field of electronics.

Flexible printed circuits (FPCs) have transformed the landscape of electronics, enabling compact, lightweight, and highly efficient designs. While both double-sided and multilayer configurations exist, a significant majority of flexible PCBs are double-sided. Here’s an exploration of the reasons behind this trend. 1. Cost Efficiency One of the primary reasons for the prevalence of double-sided flexible PCBs is cost. Manufacturing multilayer PCBs involves more complex processes, including additional lamination and more intricate design requirements. Double-sided FPCs can be produced at a lower cost, making them more appealing for a wide range of applications, especially in consumer electronics where budget constraints are significant. 2. Simpler Design and Manufacturing Process Double-sided flexible PCBs are generally easier to design and fabricate compared to multilayer boards. The manufacturing process for multilayer FPCs is more intricate, requiring precise alignment and additional stages of production. This complexity can lead to longer lead times and increased chances of defects. In contrast, double-sided PCBs offer a more straightforward approach, facilitating quicker turnaround times and reduced manufacturing risks. 3. Sufficient Density for Many Applications Many applications that utilize flexible PCBs do not require the high density that multilayer configurations provide. Double-sided designs can often accommodate the necessary components and routing without the need for additional layers. This is particularly true in consumer devices like smartphones and wearables, where the size and weight constraints can often be met with double-sided FPCs.   4. Enhanced Flexibility and Bend Radius Double-sided flexible PCBs inherently offer better flexibility and a smaller bend radius than multilayer boards. This flexibility is crucial in applications where the PCB needs to fit into tight spaces or move dynamically. The more layers added to a PCB, the less flexible it becomes. For applications that require frequent bending or twisting, double-sided designs are often the preferred choice. 5. Thermal Management Thermal management is an essential consideration in PCB design. Double-sided FPCs can facilitate better heat dissipation due to their simpler structure, allowing heat to spread more evenly across the surface. In contrast, multilayer boards can trap heat between layers, potentially leading to overheating issues. 6. Fewer Connection Points Double-sided flexible PCBs typically require fewer vias and connection points than multilayer configurations. This reduction simplifies the overall design and can lead to improved reliability. Fewer points of potential failure can enhance the lifespan and performance of the final product. 7. Application Suitability Certain applications, particularly in the automotive and medical sectors, often rely on double-sided flexible PCBs. These sectors prioritize durability and reliability over extreme miniaturization, making double-sided designs ideal. The robust nature of double-sided FPCs aligns well with the stringent requirements of these industries. Conclusion While multilayer flexible PCBs have their place in highly complex and dense electronic designs, double-sided FPCs dominate the market due to their cost efficiency, simpler manufacturing processes, sufficient density for many applications, enhanced flexibility, and improved thermal management. As technology continues to advance and the demand for flexible electronics grows, double-sided flexible PCBs will remain a cornerstone of modern electronic design, offering a practical balance between performance and manufacturability.  

Introduction Rogers’ RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, designed to deliver exceptional electrical efficiency and mechanical strength at competitive prices.   As an extension of the RO3000 series, RO3210 materials are specifically engineered to enhance mechanical stability, making them a standout choice in the industry.     Features and Benefits RO3210 materials boast a dielectric constant (Dk) of 10.2, with tolerance of ± 0.5, allowing for more compact designs and providing the possibility of miniaturization.   With a dissipation factor of .0027 at 10 GHz, it minimizes signal loss and distortion.   RO3210 features a high thermal conductivity of 0.81 W/mK and excellent CTE value on X, Y and Z axis.   The RO3210 material offers exceptional dimensional stability, elevating the precision and reliability of the final PCBs and bolstering production yields.     Its surface smoothness facilitates finer line etching tolerances, enabling the creation of intricate circuit designs with heightened accuracy.   Moreover, the RO3210 is adept at integrating into epoxy multi-layer board hybrid designs, providing a blend of versatility and reliability for intricate and sophisticated circuit configurations.   PCB Capability (RO3210) PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3210 Dielectric constant: 10.2±0.5 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 25mil(0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc..   PCB Capabilities We specialize in manufacturing high-quality PCBs using RO3210 material, customized to meet a diverse range of specifications for your unique projects.   We can provide you with single-layer to complex multi-layer and hybrid PCB designs.   This board is available with two distinct copper weight options: 1oz (35µm) and 2oz (70µm), allowing you to choose the level of conductivity that aligns best with your specific requirements.   You have the choice between two thickness options: 25 mils (0.635mm) and 50 mils (1.27mm), providing versatility in design and functionality.   Our capabilities extend to PCBs with a maximum size of 400mm X 500mm, ensuring compatibility with a wide range of board dimensions.   We provide solder masks in various colors like green, black, blue, yellow and red etc.   A variety of surface finishes such as bare copper, HASL, immersion tin, immersion silver, immersion gold, pure gold, ENEPIG, OSP are available in house.   Applications RO3210 PCBs are extensively utilized in a diverse range of fields, including automotive collision avoidance systems, automotive GPS antennas, wireless telecommunications systems, microstrip patch antennas for wireless communications, and direct broadcast satellites etc.   Thank you. I’ll see you next time.

Introduction Rogers RO4730G3 antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary mechanical and electrical properties for ideal antenna performance.   RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.     Features RO4730G3 features a dielectric constant of 3.0 with a tight tolerance of just ±0.05. This precise and consistent dielectric property ensures optimal signal integrity and predictable impedance control in your circuit designs.   Additionally, it delivers exceptional dissipation factors of just 0.0028, enabling efficient signal transmission and minimizing energy losses in the high-frequency designs.   RO4730G3 exhibits a remarkably low Z-axis coefficient of thermal expansion (CTE) at just 35.2 ppm/°C. This low CTE helps minimize the risk of delamination and improves the long-term reliability of your circuits, even under demanding thermal conditions.   Complementing its low CTE, RO4730G3 also boasts a low temperature coefficient of dielectric constant (TCDk) of just 34 ppm/°C. This exceptional thermal stability ensures your circuit's performance remains consistent, even as temperatures fluctuate.   Finally, RO4730G3 features an exceptionally high glass transition temperature (Tg) of greater than 280°C. This high Tg ensures the material can withstand the elevated temperatures encountered during manufacturing and operation, further enhancing the long-term reliability of the circuits.   PCB Capability (RO4730G3) PCB Material: Hydrocarbon ceramic woven glass Designator: RO4730G3 Dielectric constant: 3.0 ±0.05 (process); 2.98 (design) Layer count: 1-layer, 2-layer, Multi-layer, Hybrid configuration Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness (LoPro Copper): 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) Laminate thickness (ED Copper) 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc.   PCB Capability (RO4730G3) Our RO4730G3 PCBs are custom-made to meet a wide range of specifications to suit your project needs.   Choose from a variety of layer counts including single layer, double layer, multi-layer, and hybrid configurations. Copper weights available in 1oz (35µm) and 2oz (70µm).   The laminate thickness options include LoPro Copper at 5.7mil to 60.7mil and ED Copper at 20mil to 60mil, providing flexibility for diverse applications.   Maximum PCB size of 400mm X 500mm ensures compatibility with various designs. Customize your boards with solder mask colors such as green, black, blue, yellow, and red, among others.   Select from surface finishes like bare copper, HASL, ENIG, immersion tin, immersion silver, ENEPIG, pure gold, OSP, and more.     Applications The RO4730G3 is typically for the applications of Cellular Base Station Antennas.   Thank you. I’ll see you next time.

Introduction Taconic TLX-8 is a PTFE microwave substrate reinforced with high-volume fiberglass, making it an excellent choice for low layer count microwave designs and ensuring reliability across a wide range of RF applications.   In the domain of RF microwave substrates, TLX-8 emerges as a dependable choice with its fiberglass reinforcement providing crucial mechanical strength, especially in challenging environments that PCBs may encounter, including:   Resisting creep for PCBs bolted to housings experiencing high vibration levels during space launches; Enduring high temperatures within engine modules; Demonstrating radiation resistance in space; Withstanding extreme conditions at sea for warship antennas; and Maintaining functionality across a broad temperature range for altimeter substrates during flights.     Features TLX-8 features a low and stable dielectric constant of 2.55±0.04 at 1Mhz, ensuring consistent electrical properties in microwave designs.   It features a low dissipation factor of 0.0018 at 10GHz, indicating minimal energy loss during signal transmission.   TLX-8 excels in outgassing properties, showcasing a Total Mass Loss (TML) of 0.03% and Collected Volatile Condensable Materials (CVCM) percentage of 0.00%. The material's Water Vapor Regain (WVR) of 0.01% underscores its ability to absorb moisture effectively, making it ideal for environments with fluctuating humidity levels.   Additionally, the material has low moisture absorption of 0.02%, which is crucial for maintaining performance in humid environments.   Moreover, TLX-8 has a UL 94 V-0 rating, meeting stringent flammability standards and ensuring safety in various applications.   PCB Capability (TLX-8) PCB Material: PTFE Fiberglass Composites Designation: TLX-8 Dielectric constant: 2.55 ± 0.04 1MHz Dissipation Factor 0.0018 10GHz Layer count: Single Sided, Double Sided Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 110mil(2.79mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability Our manufacturing capability for TLX-8 encompasses a diverse range of specifications to meet various design requirements.   We offer fabrication for single-sided and double-sided PCBs with copper weights ranging from 1oz (35µm) to 2oz (70µm).   PCB thickness options include 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), and 110mil (2.79mm), ensuring flexibility for different applications.   In terms of size, we can accommodate PCBs up to 400mm X 500mm, providing ample space for your designs.   Our solder mask options include popular colors such as green, black, blue, yellow, and red, allowing for customization based on your preferences.   For surface finishes, we offer a variety of choices to suit your specific needs, including bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG , OSP, and pure gold.     PCB Applications TLX-8 PCBs are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components due to its reliable properties and consistent performance.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 6006 stands out as a ceramic-PTFE composite meticulously crafted for electronic and microwave circuit applications that demand a superior dielectric constant. These materials are engineered to offer a high level of dielectric constant (Dk), facilitating the reduction of circuit size with remarkable efficiency. Known for their minimal loss characteristics, RT/duroid 6006 excels in operations within the X-band spectrum or lower frequencies. Its precise Dk and thickness control ensure consistent circuit performance.     Features The outstanding characteristics of RT/duroid 6006 encompass a dielectric constant (Dk) of 6.15 +/- 0.15 and an impressively low dissipation factor of only 0.0027 at 10GHz, guaranteeing minimal signal attenuation.   Clad with both standard and reverse treated electrodeposited copper foil, RT/duroid 6006 laminates offer choices for reducing insertion loss or enhancing peel strength.   Furthermore, Their low moisture absorption rate and ability to support reliable plated through-holes in multi-layer boards elevate them as a top-tier choice for electronic and microwave circuits.   PCB Capability (RT/duroid 6006) PCB Material: Ceramic-PTFE Composites Designation: RT/duroid 6006 Dielectric constant: 6.15 ± 0.15 @10GHz Dissipation Factor 0.0027 @10GHz Layer count: Single Sided, Double Sided, Multi-layer, Hybrid Configuration Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability (RT/duroid 6006) Our manufacturing capabilities are extensive and versatile, covering a wide range of specifications to meet diverse needs.   We excel in producing PCBs with various layer counts, including Single Sided, Double Sided, Multi-layer, and Hybrid Configurations.   You can choose from copper weights of 1oz (35µm) or 2oz (70µm) and select PCB thicknesses from standard 25 mils, 50 mils and 75 mils.   Additional non-standard thicknesses available from 5 mils to 200 mils in increments of 5 mils.   Our production capabilities extend to PCB sizes up to 400mm x 500mm, offering flexibility for different project requirements.   When it comes to aesthetics and functionality, we provide a spectrum of solder mask colors such as Green, Black, Blue, Yellow, and Red, among others.   Additionally, our surface finish options are comprehensive, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold, and so on.     Applications RT/duroid 6006 PCBs find their place in a variety of applications, such as patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems etc.   Thank you. I’ll see you next time.

Introduction Taconic RF-35TC high frequency materials are PTFE based, ceramic filled fiberglass laminates which provide low dissipation factor and high thermal conductivity. The heat is diffused away from both transmission lines and surface mount components such as capacitors etc. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors. This material is best suited for high power applications.     Benefits RF-35TC offers several significant benefits that make it an ideal choice for RF applications.   Firstly, it features a "Best in Class" loss tangent of 0.002 at 10GHz, resulting in minimal signal loss and superior signal integrity.   Secondly, RF-35TC excels in thermal management with a true thermal conductivity of 0.6W/m/k (unclad),effectively dissipating component-generated heat.   Another key benefit lies in its stable dielectric constant (Dk) across a wide temperature spectrum, ensuring consistent electrical performance in varying environmental conditions.   RF-35TC enhances antenna gains and efficiencies, contributing to superior signal propagation and reception, thereby improving antenna performance.   Furthermore, its excellent adhesion to Very Low Profile (VLP) copper ensures robust bonding between PCB material and copper layers, enhancing reliability and durability for demanding applications.   PCB Capability (RF-35TC) PCB Material: PTFE based, ceramic filled fiberglass substrate Designation: RF-35TC Dielectric constant: 3.5 Dissipation Factor 0.002 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion gold, Immersion silver, Immersoin tin, ENEPIG, Pure gold, OSP etc..   PCB Capability We offer a variety of capabilities for RF-35TC PCBs, including single-layer, double-layer, multi-layer, and hybrid board configurations.   RF-35TC PCBs come in a wide range of thicknesses, including standard options like 5 mils, 10 mils, 20 mils, 30 mils, and 60 mils. The finished copper on the PCB can be 1oz or 2oz.   Our high-frequency PCBs can reach a maximum size of 400mm by 500mm, allowing for single-board or multiple design panel configurations. We provide solder mask options in green, black, blue, yellow, and more in-house.   Various pad plating options are available, including bare copper, HASL, immersion gold, immersion silver, immersion tin, ENEPIG, Pure gold, and OSP etc.     Applications RF-35TC PCB is ideal for a wide range of components and systems crucial for thermal management applications, encompassing filters, couplers, power amplifiers, antennas, and satellites.   Thank you for watching. See you next time.