quality RF PCB Board & Rogers PCB Board factory

On June 3, Xiaomi held its Investor Day event. It was reported that Lei Jun and other Xiaomi executives, including Lu Weibing, discussed topics such as chips, Xiaomi cars, and smartphones.   Smartphone Business: In 2024, Xiaomi is expected to gain over 13 million net new users, with 5.5 million coming from Apple and Huawei users. Lu Weibing emphasized that "without scale, there is no competitiveness," stating, "Capabilities drive outcomes, and transformation is the key."   Lei Jun shared the impressive results from Xiaomi's new retail attempts in Hong Kong, indicating that Xiaomi would strongly promote this model in developed countries and regions.   Lu Weibing revealed that Xiaomi's offline channel costs for home appliances are 15-20 percentage points lower than competitors. Additionally, Xiaomi stated that it would continue to control hardware profit margins at 5%.   YU7 Pricing to Be Confirmed Days Before Launch The automotive business is currently a key focus for Xiaomi. During the Investor Day, Lei Jun mentioned that Xiaomi's automotive division is expected to become profitable in the third and fourth quarters of this year.   According to the financial report released by Xiaomi Group, revenue from Xiaomi's smart electric vehicles rose from 18.4 million yuan in Q1 2024 to 18.1 billion yuan in Q1 2025. In Q1 2025, the company delivered a total of 75,869 Xiaomi SU7 series vehicles.   Moreover, the gross margin for Xiaomi's automotive business has been steadily improving, increasing from 20.4% in the previous quarter to 23.2% in Q1 this year. Xiaomi attributed this rise to the different product mix of the Xiaomi SU7 series delivered during the quarter (including the SU7 Ultra) and an increase in gross margins of other related businesses.   Currently, Xiaomi only sells the Xiaomi SU7 model, with official data showing that delivery numbers for both April and May surpassed 28,000 vehicles.   Previously, Xiaomi's first SUV model, the Xiaomi YU7, was unveiled on May 22, positioned as a luxury high-performance SUV, set to officially launch in July.   At the Xiaomi Investor Conference, Lei Jun disclosed that the latest Xiaomi YU7 price could not be the rumored 235,900 yuan, and the official price would be confirmed 1-2 days prior to launch.   After this, Lu Weibing, Xiaomi Group partner and president, mentioned during the Q1 earnings call that the YU7 received widespread appreciation from users after its pre-release, becoming more popular than the SU7 at its debut.   Lu Weibing revealed that the consultation inquiries for the YU7 after its technical announcement exceeded those of the SU7 during the same period, with user interest being about three times greater. The YU7 has a broader audience, and Xiaomi is very confident about it.   Recently, Xiaomi's automotive division stated that it is preparing for large-scale production of the YU7. In response to questions about whether capacity would be sufficient after the YU7's launch and if there would be delays in delivery, Xiaomi expressed confidence in delivering to users as quickly as possible after the official launch.   During the aforementioned Investor Conference, Lei Jun also mentioned that Xiaomi began investing in robotics research and development five years ago. Currently, their automotive factory is testing relevant capabilities, and Xiaomi's automotive chips are under development, expected to be launched soon.   ------------------------------------------------------------------------------- Source: Caixin, The Paper, Elephant News, Financial Statement: We respect originality and value sharing; the copyrights for text and images belong to the original authors. The purpose of reprint is to share more information and does not represent the stance of this account. If your rights are infringed, please contact us promptly, and we will delete it as soon as possible. Thank you.

The dielectric constant (DK) is a crucial property of materials used in printed circuit boards (PCBs), influencing their performance in various applications. One significant factor affecting DK is temperature. This article examines how fluctuations in temperature affect the dielectric constant and the consequences for PCB design and performance.   Understanding Dielectric Constant   The dielectric constant is a measure of a material's ability to store electrical energy in an electric field. It plays a vital role in determining how signals propagate through PCB materials. A higher DK indicates greater capacitance and can affect signal speed, impedance, and overall circuit performance.   Temperature Dependence of Dielectric Constant   1. General Trends Increase in Temperature: As temperature rises, the dielectric constant of most materials tends to decrease. This phenomenon occurs because increased thermal energy enhances molecular motion, which diminishes the material's polarizability.   Decrease in Temperature: Lowering the temperature typically results in an increased dielectric constant. Reduced molecular motion leads to higher polarizability, thereby increasing the material's ability to store electrical energy.   2. Material-Specific Behavior Different materials respond to temperature changes in various ways. For example:   Ceramics: These materials may exhibit a more pronounced change in dielectric constant with temperature fluctuations compared to polymers.   Polymers: While they generally experience a decrease in DK with increasing temperature, the extent of this change can vary based on the specific polymer used.   Frequency Dependence The effect of temperature on DK can also depend on the frequency of the applied electric field. At certain frequencies, dielectric properties may stabilize, whereas at others, significant variations can occur. This frequency dependence is particularly relevant in high-speed and RF applications, where maintaining consistent electrical characteristics is crucial.   Implications for PCB Performance   1. Signal Integrity Variations in DK due to temperature can significantly impact signal integrity. A lower DK at elevated temperatures may lead to increased signal delay and distortion, affecting the overall performance of high-speed circuits.   2. Impedance Control The dielectric constant directly influences the characteristic impedance of PCB traces. Accurate DK values are essential for ensuring proper impedance matching, which minimizes signal reflection and loss. Designers must account for temperature-induced DK variations to maintain consistent impedance throughout the operating temperature range.   3. Thermal Management Temperature changes can also affect heat dissipation in PCBs. Materials with suitable DK values can help manage thermal performance, ensuring that circuits operate reliably under varying thermal conditions.   Thermal Expansion Considerations As temperature fluctuates, materials expand or contract, potentially altering the geometry of the PCB. This change can further impact the effective dielectric constant, complicating the design process. Understanding these thermal expansion characteristics is essential for achieving accurate electrical performance.   Conclusion The relationship between temperature and dielectric constant is a critical consideration in PCB design. As temperature affects DK, it can influence signal integrity, impedance, and overall circuit performance. Designers must carefully select materials and account for temperature variations to ensure reliability and efficiency, especially in high-frequency and temperature-variable applications. By understanding and managing the impact of temperature on dielectric constant, engineers can create robust PCBs that meet the demands of modern electronics.

In the manufacturing and assembly of printed circuit boards (PCBs), cleaning and drying are crucial steps that significantly influence their performance, reliability, and overall quality. As electronic devices become more complex and compact, the need for impeccable PCB cleanliness has never been more essential. This article delves into the necessity of cleaning PCBs and the various methods employed for effective drying after cleaning.   The Necessity of PCB Cleaning   1. Removal of Contaminants During the PCB manufacturing process, various contaminants can accumulate on the surface of the boards. These may include oils from manufacturing equipment, dust from the production environment, and chemical residues from soldering processes. If not removed, these contaminants can interfere with electrical connections and lead to circuit failures. Cleaning is, therefore, a critical step that ensures a pristine surface, facilitating reliable electrical performance.   2. Improving Solder Quality A clean PCB surface is essential for achieving high-quality solder joints. Contaminants can lead to poor wetting of the solder, resulting in weak joints that may fail under mechanical stress. Proper cleaning ensures that the solder has a good surface to adhere to, thereby enhancing the reliability of the soldering process and ultimately the durability of the entire electronic assembly.   3. Preventing Corrosion Residual chemicals and moisture left on PCBs can lead to corrosion of metal components, which can significantly shorten the lifespan of the device. Corrosion can create conductive pathways that lead to short circuits, potentially damaging the device. Regular cleaning helps eliminate these harmful substances, reducing the risk of corrosion and improving the longevity of the PCB.   4. Enhancing Electrical Performance The presence of impurities can negatively affect the electrical characteristics of a PCB. Contaminants can lead to increased signal loss and interference, particularly in high-frequency applications. By removing these impurities through effective cleaning, manufacturers can ensure stable signal transmission and improved overall electrical performance.   5. Meeting Quality Standards Many industries—especially those in aerospace, automotive, and medical fields—have stringent cleanliness requirements for PCBs. Compliance with these standards is critical for quality assurance and product certification. Cleaning processes help ensure that PCBs meet these requirements, thus avoiding costly rework and potential product failures in the field.   Drying Treatment After PCB Cleaning Once the cleaning process is complete, drying is essential to preserve the integrity and performance of the boards. Moisture left on the PCB can lead to a host of issues, including corrosion and compromised electrical performance. Here are several commonly used drying methods:   1. Hot Air Drying Hot air drying involves using hot air blowers or ovens to evaporate moisture from the PCB. This method is effective for quickly removing surface moisture. However, it is crucial to control the temperature carefully to avoid overheating, which can damage sensitive components or alter the material properties of the PCB. Ensuring uniform air circulation is also vital for consistent drying results.   2. Vacuum Drying Vacuum drying is an efficient method that accelerates moisture evaporation by reducing the atmospheric pressure around the PCB. This technique is particularly beneficial for complex PCB designs with intricate geometries where moisture may be trapped. While effective, vacuum drying requires specialized equipment and careful monitoring to ensure optimal results.   3. Natural Air Drying Natural air drying involves placing the cleaned PCB in a well-ventilated area, allowing it to dry spontaneously. This method is simple and cost-effective; however, it can take longer than other methods. The drying time can be influenced by environmental factors such as temperature and humidity, making it less predictable.   4. Heat Plate Drying In this method, the PCB is placed on a heated plate, which accelerates drying through conduction. Heat plate drying is efficient but requires careful temperature control to prevent localized overheating, which could damage components or the PCB material itself.   5. Using Desiccants Placing the cleaned PCB in a sealed container with desiccants (such as silica gel) helps absorb any residual moisture. This method is particularly useful for long-term storage of PCBs, as it prevents moisture accumulation over time. Regularly changing the desiccants is important to maintain their effectiveness.   Conclusion The cleaning and drying of PCBs are vital processes that directly impact their performance, reliability, and lifespan. Effective cleaning removes contaminants that can impair electrical connections and lead to failures, while proper drying ensures that moisture does not compromise the integrity of the board. By understanding the importance of these processes and implementing suitable methods, manufacturers can significantly enhance the quality of their PCBs.

In PCB (Printed Circuit Board) manufacturing, a "golden finger" refers to a gold-plated connector or contact area on a PCB. These fingers are crucial for establishing electrical connections and ensuring reliable signal transmission between the PCB and other components or devices.   1. Purpose and Functionality   Electrical Connection Golden fingers serve as connectors that interface with sockets, connectors, or other PCBs. They facilitate communication and power transfer within electronic devices, playing a vital role in ensuring that the device operates efficiently and effectively.   Signal Integrity One of the key advantages of using golden fingers is their ability to enhance signal integrity. The gold plating provides a low-resistance connection, which is essential for maintaining signal quality, especially in high-speed data transmission applications. This feature is particularly important in modern electronics, where even minor signal degradation can lead to performance issues.   2. Material and Coating   Gold Plating Golden fingers are typically coated with a thin layer of gold over nickel. Gold is selected for its excellent electrical conductivity, resistance to corrosion, and durability. The nickel layer serves as a barrier to prevent diffusion of gold into the underlying copper, enhancing the overall performance of the connection.   Thickness The thickness of the gold plating can vary based on application requirements. For instance, thicker gold layers are generally used in high-wear applications where mechanical stress is expected, while thinner layers may suffice for less demanding environments.   3. Applications   Computer Boards Golden fingers are commonly found in computer motherboards, graphics cards, and other devices where reliable connections are critical. They provide the necessary interface for connecting various components, such as RAM, CPUs, and GPUs, ensuring that data flows seamlessly between them.   Consumer Electronics In addition to computer hardware, golden fingers are utilized in various consumer electronics, including gaming consoles, printers, and communication devices. Their robustness and reliability make them ideal for devices that require consistent performance over time.   Industrial Applications Golden fingers are also used in industrial applications where durable connections are necessary. For example, they may be found in control systems, automation equipment, and instrumentation devices that operate in challenging environments.   4. Manufacturing Considerations   Precision The manufacturing process for golden fingers requires precision and attention to detail. Accurate dimensions and plating thickness are critical to ensure compatibility with connectors and sockets. Any deviation can result in poor connectivity or functional failure.   Quality Control Rigorous quality control measures are essential during production to ensure that the gold plating is uniform and free from defects. This may involve visual inspections, electrical testing, and other assessments to verify that the golden fingers meet specified standards.   5. Benefits   Durability One of the primary benefits of golden fingers is their durability. Gold is highly resistant to oxidation and corrosion, which enhances the longevity of the connections. This is particularly advantageous in environments where exposure to moisture or contaminants is likely.   Reliability Using gold plating ensures reliable electrical connections, significantly reducing the risk of signal loss or failure. This reliability is crucial in applications where consistent performance is necessary, such as in telecommunications and data centers.   Cost-Effectiveness While gold is more expensive than other materials, the long-term benefits of using golden fingers—such as reduced maintenance costs and lower failure rates—can make them a cost-effective choice in the long run.   Conclusion Golden fingers play a vital role in PCB manufacturing by providing reliable electrical connections and enhancing signal integrity. Their use of gold plating not only ensures durability but also meets the demands of high-performance applications across various industries. As technology continues to evolve, the importance of golden fingers in maintaining robust electronic connections remains indispensable.

Recently, global semiconductor manufacturing leader TSMC announced a partnership with the U.S. startup Avicena to jointly produce Micro LED-based optical interconnect products. This collaboration aims to replace traditional electrical connections with advanced optical communication technology, providing low-cost, high-efficiency data transmission solutions for the growing demands of graphics processors (GPUs).   "TSMC is focusing on non-typical optical technologies!" On May 26, IEEE Spectrum reported that TSMC is producing Micro LED light source receivers (PD) for the U.S. Micro LED startup Avicena.   Micro LED is a new technology that has emerged in the past decade, primarily used in televisions and smartwatches. Although it offers low energy consumption, high brightness, and long lifespan, each pixel requires an independent chip, leading to costs that can reach millions or even tens of millions of chips for a single panel.   Currently, display manufacturers are actively exploring the use of Micro LED for data center chip transmission light sources, aiming to replace traditional copper cables or more advanced laser transmission. Founded in 2019, Avicena is one of many players in this field and has received investments from semiconductor companies such as SK Hynix, Micron, Samsung, and Corning.   One of the favorable contenders in the Micro LED optical communication race is Rayli Light Intelligence, led by brothers He Zhihao (left) and He Zhiqiang.   To meet the high bandwidth data transmission needs of artificial intelligence (AI) servers, companies like Broadcom and NVIDIA have introduced Co-Packaged Optical (CPO) switch architectures, placing external laser modules and optical fibers next to chips as light sources for "long-distance transmission," replacing traditional optical transceiver modules and copper wires used in server cabinets.   However, short-distance transmission between chips in a cabinet still primarily relies on traditional copper wiring. Avicena believes Micro LED offers lower power consumption and greater bandwidth than copper, and has successfully persuaded TSMC to assist in this endeavor.   Lucas Tsai, Vice President of TSMC North America, pointed out that LEDs are widely used in consumer electronics and have much lower power consumption compared to lasers, making them very suitable for short-distance transmission.   ------------------------------------- Source: Tech News Statement: We respect originality and value sharing; the copyrights for text and images belong to the original authors. The purpose of reprint is to share more information and does not represent the stance of this account. If your rights are infringed, please contact us promptly, and we will delete it as soon as possible. Thank you.

Introduction Rogers’ RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, designed to deliver exceptional electrical efficiency and mechanical strength at competitive prices.   As an extension of the RO3000 series, RO3210 materials are specifically engineered to enhance mechanical stability, making them a standout choice in the industry.     Features and Benefits RO3210 materials boast a dielectric constant (Dk) of 10.2, with tolerance of ± 0.5, allowing for more compact designs and providing the possibility of miniaturization.   With a dissipation factor of .0027 at 10 GHz, it minimizes signal loss and distortion.   RO3210 features a high thermal conductivity of 0.81 W/mK and excellent CTE value on X, Y and Z axis.   The RO3210 material offers exceptional dimensional stability, elevating the precision and reliability of the final PCBs and bolstering production yields.     Its surface smoothness facilitates finer line etching tolerances, enabling the creation of intricate circuit designs with heightened accuracy.   Moreover, the RO3210 is adept at integrating into epoxy multi-layer board hybrid designs, providing a blend of versatility and reliability for intricate and sophisticated circuit configurations.   PCB Capability (RO3210) PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3210 Dielectric constant: 10.2±0.5 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 25mil(0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion tin, Immersion silver, Immersion gold, Pure gold, ENEPIG, OSP etc..   PCB Capabilities We specialize in manufacturing high-quality PCBs using RO3210 material, customized to meet a diverse range of specifications for your unique projects.   We can provide you with single-layer to complex multi-layer and hybrid PCB designs.   This board is available with two distinct copper weight options: 1oz (35µm) and 2oz (70µm), allowing you to choose the level of conductivity that aligns best with your specific requirements.   You have the choice between two thickness options: 25 mils (0.635mm) and 50 mils (1.27mm), providing versatility in design and functionality.   Our capabilities extend to PCBs with a maximum size of 400mm X 500mm, ensuring compatibility with a wide range of board dimensions.   We provide solder masks in various colors like green, black, blue, yellow and red etc.   A variety of surface finishes such as bare copper, HASL, immersion tin, immersion silver, immersion gold, pure gold, ENEPIG, OSP are available in house.   Applications RO3210 PCBs are extensively utilized in a diverse range of fields, including automotive collision avoidance systems, automotive GPS antennas, wireless telecommunications systems, microstrip patch antennas for wireless communications, and direct broadcast satellites etc.   Thank you. I’ll see you next time.

Introduction Rogers RO4730G3 antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary mechanical and electrical properties for ideal antenna performance.   RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.     Features RO4730G3 features a dielectric constant of 3.0 with a tight tolerance of just ±0.05. This precise and consistent dielectric property ensures optimal signal integrity and predictable impedance control in your circuit designs.   Additionally, it delivers exceptional dissipation factors of just 0.0028, enabling efficient signal transmission and minimizing energy losses in the high-frequency designs.   RO4730G3 exhibits a remarkably low Z-axis coefficient of thermal expansion (CTE) at just 35.2 ppm/°C. This low CTE helps minimize the risk of delamination and improves the long-term reliability of your circuits, even under demanding thermal conditions.   Complementing its low CTE, RO4730G3 also boasts a low temperature coefficient of dielectric constant (TCDk) of just 34 ppm/°C. This exceptional thermal stability ensures your circuit's performance remains consistent, even as temperatures fluctuate.   Finally, RO4730G3 features an exceptionally high glass transition temperature (Tg) of greater than 280°C. This high Tg ensures the material can withstand the elevated temperatures encountered during manufacturing and operation, further enhancing the long-term reliability of the circuits.   PCB Capability (RO4730G3) PCB Material: Hydrocarbon ceramic woven glass Designator: RO4730G3 Dielectric constant: 3.0 ±0.05 (process); 2.98 (design) Layer count: 1-layer, 2-layer, Multi-layer, Hybrid configuration Copper weight: 1oz (35µm), 2oz (70µm) Laminate thickness (LoPro Copper): 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) Laminate thickness (ED Copper) 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc.   PCB Capability (RO4730G3) Our RO4730G3 PCBs are custom-made to meet a wide range of specifications to suit your project needs.   Choose from a variety of layer counts including single layer, double layer, multi-layer, and hybrid configurations. Copper weights available in 1oz (35µm) and 2oz (70µm).   The laminate thickness options include LoPro Copper at 5.7mil to 60.7mil and ED Copper at 20mil to 60mil, providing flexibility for diverse applications.   Maximum PCB size of 400mm X 500mm ensures compatibility with various designs. Customize your boards with solder mask colors such as green, black, blue, yellow, and red, among others.   Select from surface finishes like bare copper, HASL, ENIG, immersion tin, immersion silver, ENEPIG, pure gold, OSP, and more.     Applications The RO4730G3 is typically for the applications of Cellular Base Station Antennas.   Thank you. I’ll see you next time.

Introduction Taconic TLX-8 is a PTFE microwave substrate reinforced with high-volume fiberglass, making it an excellent choice for low layer count microwave designs and ensuring reliability across a wide range of RF applications.   In the domain of RF microwave substrates, TLX-8 emerges as a dependable choice with its fiberglass reinforcement providing crucial mechanical strength, especially in challenging environments that PCBs may encounter, including:   Resisting creep for PCBs bolted to housings experiencing high vibration levels during space launches; Enduring high temperatures within engine modules; Demonstrating radiation resistance in space; Withstanding extreme conditions at sea for warship antennas; and Maintaining functionality across a broad temperature range for altimeter substrates during flights.     Features TLX-8 features a low and stable dielectric constant of 2.55±0.04 at 1Mhz, ensuring consistent electrical properties in microwave designs.   It features a low dissipation factor of 0.0018 at 10GHz, indicating minimal energy loss during signal transmission.   TLX-8 excels in outgassing properties, showcasing a Total Mass Loss (TML) of 0.03% and Collected Volatile Condensable Materials (CVCM) percentage of 0.00%. The material's Water Vapor Regain (WVR) of 0.01% underscores its ability to absorb moisture effectively, making it ideal for environments with fluctuating humidity levels.   Additionally, the material has low moisture absorption of 0.02%, which is crucial for maintaining performance in humid environments.   Moreover, TLX-8 has a UL 94 V-0 rating, meeting stringent flammability standards and ensuring safety in various applications.   PCB Capability (TLX-8) PCB Material: PTFE Fiberglass Composites Designation: TLX-8 Dielectric constant: 2.55 ± 0.04 1MHz Dissipation Factor 0.0018 10GHz Layer count: Single Sided, Double Sided Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 110mil(2.79mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability Our manufacturing capability for TLX-8 encompasses a diverse range of specifications to meet various design requirements.   We offer fabrication for single-sided and double-sided PCBs with copper weights ranging from 1oz (35µm) to 2oz (70µm).   PCB thickness options include 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), and 110mil (2.79mm), ensuring flexibility for different applications.   In terms of size, we can accommodate PCBs up to 400mm X 500mm, providing ample space for your designs.   Our solder mask options include popular colors such as green, black, blue, yellow, and red, allowing for customization based on your preferences.   For surface finishes, we offer a variety of choices to suit your specific needs, including bare copper, HASL, ENIG, immersion silver, immersion tin, ENEPIG , OSP, and pure gold.     PCB Applications TLX-8 PCBs are ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components due to its reliable properties and consistent performance.   Thank you. I’ll see you next time.

Introduction Rogers RT/duroid 6006 stands out as a ceramic-PTFE composite meticulously crafted for electronic and microwave circuit applications that demand a superior dielectric constant. These materials are engineered to offer a high level of dielectric constant (Dk), facilitating the reduction of circuit size with remarkable efficiency. Known for their minimal loss characteristics, RT/duroid 6006 excels in operations within the X-band spectrum or lower frequencies. Its precise Dk and thickness control ensure consistent circuit performance.     Features The outstanding characteristics of RT/duroid 6006 encompass a dielectric constant (Dk) of 6.15 +/- 0.15 and an impressively low dissipation factor of only 0.0027 at 10GHz, guaranteeing minimal signal attenuation.   Clad with both standard and reverse treated electrodeposited copper foil, RT/duroid 6006 laminates offer choices for reducing insertion loss or enhancing peel strength.   Furthermore, Their low moisture absorption rate and ability to support reliable plated through-holes in multi-layer boards elevate them as a top-tier choice for electronic and microwave circuits.   PCB Capability (RT/duroid 6006) PCB Material: Ceramic-PTFE Composites Designation: RT/duroid 6006 Dielectric constant: 6.15 ± 0.15 @10GHz Dissipation Factor 0.0027 @10GHz Layer count: Single Sided, Double Sided, Multi-layer, Hybrid Configuration Copper weight: 1oz (35µm), 2oz (70µm) PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..   PCB Capability (RT/duroid 6006) Our manufacturing capabilities are extensive and versatile, covering a wide range of specifications to meet diverse needs.   We excel in producing PCBs with various layer counts, including Single Sided, Double Sided, Multi-layer, and Hybrid Configurations.   You can choose from copper weights of 1oz (35µm) or 2oz (70µm) and select PCB thicknesses from standard 25 mils, 50 mils and 75 mils.   Additional non-standard thicknesses available from 5 mils to 200 mils in increments of 5 mils.   Our production capabilities extend to PCB sizes up to 400mm x 500mm, offering flexibility for different project requirements.   When it comes to aesthetics and functionality, we provide a spectrum of solder mask colors such as Green, Black, Blue, Yellow, and Red, among others.   Additionally, our surface finish options are comprehensive, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold, and so on.     Applications RT/duroid 6006 PCBs find their place in a variety of applications, such as patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, and ground radar warning systems etc.   Thank you. I’ll see you next time.

Introduction Taconic RF-35TC high frequency materials are PTFE based, ceramic filled fiberglass laminates which provide low dissipation factor and high thermal conductivity. The heat is diffused away from both transmission lines and surface mount components such as capacitors etc. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors. This material is best suited for high power applications.     Benefits RF-35TC offers several significant benefits that make it an ideal choice for RF applications.   Firstly, it features a "Best in Class" loss tangent of 0.002 at 10GHz, resulting in minimal signal loss and superior signal integrity.   Secondly, RF-35TC excels in thermal management with a true thermal conductivity of 0.6W/m/k (unclad),effectively dissipating component-generated heat.   Another key benefit lies in its stable dielectric constant (Dk) across a wide temperature spectrum, ensuring consistent electrical performance in varying environmental conditions.   RF-35TC enhances antenna gains and efficiencies, contributing to superior signal propagation and reception, thereby improving antenna performance.   Furthermore, its excellent adhesion to Very Low Profile (VLP) copper ensures robust bonding between PCB material and copper layers, enhancing reliability and durability for demanding applications.   PCB Capability (RF-35TC) PCB Material: PTFE based, ceramic filled fiberglass substrate Designation: RF-35TC Dielectric constant: 3.5 Dissipation Factor 0.002 Layer count: Single Layer, Double Layer, Multilayer, Hybrid PCB Laminate thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) Copper weight: 1oz (35µm), 2oz (70µm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, Immersion gold, Immersion silver, Immersoin tin, ENEPIG, Pure gold, OSP etc..   PCB Capability We offer a variety of capabilities for RF-35TC PCBs, including single-layer, double-layer, multi-layer, and hybrid board configurations.   RF-35TC PCBs come in a wide range of thicknesses, including standard options like 5 mils, 10 mils, 20 mils, 30 mils, and 60 mils. The finished copper on the PCB can be 1oz or 2oz.   Our high-frequency PCBs can reach a maximum size of 400mm by 500mm, allowing for single-board or multiple design panel configurations. We provide solder mask options in green, black, blue, yellow, and more in-house.   Various pad plating options are available, including bare copper, HASL, immersion gold, immersion silver, immersion tin, ENEPIG, Pure gold, and OSP etc.     Applications RF-35TC PCB is ideal for a wide range of components and systems crucial for thermal management applications, encompassing filters, couplers, power amplifiers, antennas, and satellites.   Thank you for watching. See you next time.