quality RF PCB Board & Rogers PCB Board factory

1. Introduction: Have You Experienced the Pain of Prototyping Failures? Many engineers spend a week on PCB design, only to have the prototype fail due to a small oversight during prototyping—like forgetting to mark silkscreen direction (causing reversed component soldering) or choosing the wrong board material (resulting in insufficient high-temperature resistance). PCB prototyping costs little, but repeated rework seriously delays project progress. Today, we’ll share 5 details to check before prototyping. 2. 5 Details to Check Before Prototyping Detail 1: Silkscreen "Clear and Non-Overlapping" to Avoid Soldering Errors   Silkscreen guides soldering. Blurry, overlapping silkscreen or incorrect polarity markings (for diodes, capacitors) cause reversed component soldering and direct board failure.   Check Method: Enable the "3D View" in design software (e.g., Altium) to see if silkscreen covers pads or overlaps with other components. Focus on checking "±" or "PIN1" markings for polar components to ensure clarity. Detail 2: Board Material "Matches Application Scenarios"—Don’t Blindly Choose Expensive Ones   Different scenarios require different PCB materials. For example, FR-4 works for ordinary consumer electronics, while FR-4 high-Tg (Tg ≥170℃) is needed for industrial high-temperature environments (temperature >85℃), and PTFE high-frequency materials for high-frequency communications (e.g., 5G). Choosing the wrong material causes PCB deformation or performance degradation in use.   Selection Advice: Use FR-4 (Tg 130-150℃) for general projects, FR-4 high-Tg (Tg ≥170℃) for industrial projects, and PTFE or Rogers materials for high-frequency projects. Clearly note the material model and parameters in the prototype order to avoid wrong deliveries. Detail 3: Copper Thickness "Meets Current Requirements" to Avoid Board Burning   Copper thickness determines the PCB’s current-carrying capacity. Too-thin copper causes copper foil overheating and burning when high current passes through. For example, 1A current requires at least 1oz (35μm) copper, and 2A requires 2oz (70μm). Many beginners default to 1oz copper, ignoring current needs.   Calculation Method: Use the formula "Current Capacity (A) = Copper Thickness (oz) × Trace Width (mm) × 0.8". For example, a 1oz copper trace with 2mm width has a current capacity of ~1.6A. If current exceeds 2A, switch to 2oz copper or widen the trace. Detail 4: Hole Size "Matches Component Pins" to Avoid Insertion Issues   Too-small through-holes or pin holes prevent component insertion; too-large holes cause cold soldering. For example, for a component with 0.8mm pins, the pin hole diameter should be ~1.0mm, and the through-hole diameter ~0.6mm (with a 1.2mm pad diameter).   Check Method: Refer to the component datasheet in the design software to confirm pin diameter. Make pin holes 0.2-0.3mm larger than the pin diameter, and through-holes 0.1-0.2mm larger. Avoid holes smaller than 0.3mm (difficult for manufacturers to process, prone to drill breakage). Detail 5: "Panelized Design" Reserves "Process Edges" for Easy Production   Omitting process edges for panelized prototyping (multiple small PCBs combined) makes machine soldering impossible—only manual soldering is feasible, which is inefficient and error-prone.   Design Requirement: Reserve 5-10mm process edges around the panel. Add positioning holes (3mm diameter, no copper) on the edges for machine alignment. Connect PCBs in the panel with "V-CUT" or "mouse-bite holes" for easy separation later. 3. Conclusion: The "Final Step" Before Prototyping—Confirm with the Manufacturer Before prototyping, send Gerber files to the manufacturer and ask their engineers to check for design issues (e.g., whether hole size, copper thickness, and material meet processing capabilities). Many manufacturers offer free DFM (Design for Manufacturability) checks, which effectively avoid rework. Remember: Spending 10 minutes checking before prototyping is better than 10 days of rework later.

1. Introduction: Why Does Your PCB Suffer From Interference? When designing industrial control or high-frequency circuits, many engineers face this problem: the PCB works normally in the lab but experiences signal loss or data errors on-site. This is mostly due to inadequate "anti-interference design." Interference comes from sources like electromagnetic radiation, poor grounding, and power noise, but solutions follow a clear pattern. Today, we’ll share 3 practical anti-interference tips you can apply directly. 2. 3 Practical Anti-Interference Tips Tip 1: "Single-Point Grounding" vs. "Multi-Point Grounding"—Choose the Right One   Grounding is the foundation of anti-interference, but many people confuse the application scenarios of these two methods. For example, using single-point grounding for high-frequency circuits (frequency >10MHz) leads to overly long ground wires, creating parasitic inductance that introduces interference. Using multi-point grounding for low-frequency circuits (frequency

September 15 News – Recently, China’s Ministry of Commerce has initiated an anti-discrimination investigation into U.S. chip trade policies and a separate inquiry into dumping practices.   The first investigation will examine whether Washington has discriminated against Chinese companies in its chip trade policies. The second will focus on alleged dumping of certain U.S. analog chips used in devices such as hearing aids, Wi-Fi routers, and temperature sensors. In a statement, the ministry noted that in recent years, the U.S. has imposed a series of restrictions on China regarding chips, including trade discrimination investigations and export controls.   It added that such "protectionist" practices are alleged to discriminate against China and aim to curb and suppress the development of high-tech industries in China, such as advanced computing chips and artificial intelligence.   A spokesperson for the Ministry of Commerce stated in response to media inquiries that the anti-dumping investigation was initiated upon the application of China’s domestic industry and complies with Chinese laws, regulations, and WTO rules. The investigation involves general-purpose interface and gate driver chips imported from the U.S.   The spokesperson mentioned that preliminary evidence submitted by the applicant shows that from 2022 to 2024, the volume of the investigated products imported from the U.S. increased by 37%, while the import price decreased by 52%. This has suppressed and driven down domestic product prices, causing harm to the production and operations of the domestic industry.   The spokesperson added that after receiving the application, the investigating authority reviewed it in accordance with the law and determined that it met the conditions for initiating an anti-dumping investigation. The authority will conduct the investigation in accordance with legal procedures, fully safeguard the rights of all interested parties, and make an objective and fair ruling based on the investigation results.   The spokesperson also stated that recently, the U.S. government has broadly defined national security concepts, abused export controls and "long-arm jurisdiction," and imposed malicious blockades and suppression on China’s chip products and artificial intelligence industry. These actions seriously violate WTO rules and undermine the legitimate rights and interests of Chinese companies, to which China firmly objects.   General-purpose interface chips are integrated circuit chips designed to provide diverse interface types for connecting various devices, systems, or components to achieve efficient data transmission and signal conversion. Gate driver chips are integrated circuit chips used to enhance the output of gate control signals from controllers and manage the switching on and off of power semiconductor devices.   ----------------------------------------- Source: Guoxin Network Disclaimer: We respect originality and value sharing. The copyrights of texts and images belong to the original authors. The purpose of reposting is to share more information, and this does not imply our endorsement of the views. If there are any infringements, please contact us, and we will delete them as soon as possible. Thank you.

On September 10, Beijing time, Apple officially unveiled four new models: the iPhone 17, iPhone Air, iPhone 17 Pro, and iPhone 17 Pro Max, with starting prices in China set at 5,999 yuan. Among the newly launched iPhone 17 Pro series, the orange, blue, and silver color variants are manufactured at Foxconn's Zhengzhou Port Area facility.   The Zhengzhou Port Area is currently in the mass production ramp-up phase for the iPhone 17 series. As production scales up, the demand for labor continues to grow. Reports indicate that "Foxconn has recruited more workers this year compared to last year." "In August, the referral bonus peaked at 9,800 yuan. During the high-demand period, tens of thousands of workers were hired daily, with the hiring surge lasting an entire week."   Temporary workers, particularly those referred through bonus programs, form a significant part of the workforce. These "referral bonus workers" receive an additional payout upon completing a specified employment period. Combined with their regular wages, they can typically save over 20,000 yuan within three months. In addition to these workers, Foxconn also employs hourly temporary workers.   During Apple's annual fall product launch cycle, the Zhengzhou Port Area factory enters its busiest period of the year. The demand for temporary workers spikes, driving referral bonuses higher. By late June, bonuses rose from 4,800 yuan to 5,000 yuan within three days. In late July, they exceeded 8,000 yuan, reaching a peak of 9,800 yuan in August before dipping to 7,300 yuan by month-end. In early September, bonuses quickly rebounded, surpassing 9,000 yuan and returning to high levels.   On the production floor, nearly 200,000 workers operate in two shifts, handling tasks such as screw fastening, film application, and component assembly. Conveyor belts continuously transport finished iPhone 17 units to the packaging workshop, where they are placed into white boxes bearing the Apple logo.   However, this workforce size is not the facility's historical peak. "At its highest, the facility employed up to 400,000 people. Apple was even more popular back then, and Foxconn was the primary manufacturer. Now, orders are more distributed, and Foxconn is no longer the sole producer," noted a source. Staff at the port area's human resources service center also confirmed, "Recently, thousands of workers have been entering daily—the volume is immense."   A long-term Foxconn employee with over a decade of experience mentioned that these temporary workers typically have contracts lasting only two to three months, aligning with the critical production ramp-up phase for Apple's new products. After this period, once production targets are met and order demand stabilizes, the facility gradually begins scaling down production lines.   A Foxconn Group HR manager stated that since August, overtime intensity has increased significantly. "Overtime work has surged dramatically, unlike last year's pace." Future production rhythms will depend on market conditions following the new product launch.   ------------------------------------- Source: Guoxin Network Disclaimer: We respect originality and value sharing. The copyrights of texts and images belong to the original authors. The purpose of reposting is to share more information, which does not imply endorsement of the views. If any infringement occurs, please contact us, and we will delete the content promptly. Thank you.

High-frequency PCBs, such as those utilizing materials like TP1020, demand a set of specialized manufacturing processes to ensure optimal performance in applications operating at 10GHz and beyond. Unlike standard FR-4 based PCBs, these high-performance substrates require meticulous control over every production stage to maintain electrical integrity, dimensional stability, and material properties.   Material Handling & Preparation The unique composition of high-frequency materials like TP1020—ceramic-filled polyphenylene oxide (PPO) resin without fiberglass reinforcement—necessitates specialized handling protocols. Prior to lamination, the raw material must be stored in a controlled environment with humidity levels below 30% and temperature maintained at 23±2°C. This prevents moisture absorption (critical given TP1020's 0.01% maximum absorption rate) which can cause dielectric constant variations exceeding ±0.2 at 10GHz.   Cutting and trimming operations require diamond-tipped tools rather than standard carbide blades. The absence of fiberglass reinforcement in TP1020 makes the material prone to chipping if subjected to excessive mechanical stress, potentially creating micro-fissures that degrade signal integrity. Laser cutting, while more expensive, is preferred for achieving the ±0.15mm dimensional tolerances required for 31mm x 31mm boards used in miniaturized antennas.   Lamination & Core Processing High-frequency laminates demand precise lamination parameters to maintain dielectric consistency. For TP1020, the lamination process operates at 190±5°C with a pressure of 200±10 psi, significantly lower than the 300+ psi used for fiberglass-reinforced materials. This lower pressure prevents ceramic particle displacement within the PPO matrix, ensuring the targeted dielectric constant of 10.2 is maintained across the entire board surface.   The 4.0mm core thickness of TP1020 PCBs requires extended dwell times during lamination—typically 90 minutes compared to 45 minutes for standard substrates. This controlled heating cycle ensures complete resin flow without creating internal voids, which would act as signal reflection points at high frequencies. Post-lamination cooling must proceed at a rate of 2°C per minute to minimize thermal stress, critical for managing TP1020's CTE of 40ppm/°C (X/Y-axis). Drilling & Plating Techniques Drilling high-frequency PCBs presents unique challenges due to the abrasive nature of ceramic fillers in materials like TP1020. Standard twist drills wear prematurely, leading to hole wall roughness exceeding 5μm—unacceptable for high-frequency signal paths. Instead, diamond-coated drill bits with a 130° point angle are required to achieve the 0.6mm minimum hole size with wall roughness

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.

Introduction Wangling’s F4BTM series laminates are fiberglass cloth, nano-ceramic fillers, and PTFE resin, followed by strict pressing processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.   F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.   Features F4BTM offers a wide range of features. With a DK range from 2.98 to 3.5, it provides flexibility in design. The addition of ceramics further enhances its performance, making it suitable for demanding applications. This material is available in various thicknesses and sizes, catering to different project requirements while offering cost savings. Its commercialization and suitability for large-scale production make it a highly cost-effective choice. Additionally, F4BTM exhibits radiation-resistant and low out-gassing properties, ensuring its reliability even in challenging environments.   PCB Capability Our PCB manufacturing capabilities cover a wide range of options. We can handle various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs.   For copper weight, we offer options of 1oz (35µm), and 2oz (70µm), allowing flexibility in conductivity requirements.   When it comes to dielectric thickness (or overall thickness), we provide a comprehensive selection of options ranging from 0.25mm to 12.0mm, catering to different design specifications.   The maximum PCB size we can accommodate is 400mm X 500mm, ensuring sufficient space for your project.   We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual distinction.   Regarding surface finish, we support several options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.   PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz) F4BTM298 2.98±0.06 0.0018 F4BTM300 3.0±0.06 0.0018 F4BTM320 3.2±0.06 0.0020 F4BTM350 3.5±0.07 0.0025 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.   F4BTM PCBs are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, and Power Amplifier etc.

Brief introduction RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.   With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.   Features RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.   The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.   RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.   The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.   RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.   After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.   Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 3.02 Z - 8 GHz - 40 GHz Differential Phase Length Method Dissipation Factor, tan d 0.0016 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.48   W/mK Float 100℃ ASTM C518 Volume Resistivity 107   MΩ.cm A ASTM D257 Surface Resistivity 107   MΩ A ASTM D257 Dimensional Stability 0.8 X, Y mm/m COND A IPC-TM-650 2.4.3.9 Moisure Absorption