Quality RF PCB Board & Rogers PCB Board Factory

"Based on our recent understanding, the copper-clad laminate industry is entering a new cycle of prosperity. Some companies are not even shutting down for the Chinese New Year holiday," said a senior executive from a well-known domestic phenolic resin company to a Securities Times reporter on January 25th. "In the process of the rise of the domestic CCL industry, the domestic substitution of core materials is expected to accelerate." Companies Ramp Up Production of High-Performance CCLs Copper-Clad Laminate (CCL) is a major application field for phenolic resin. The downstream CCL clients of the aforementioned phenolic resin company include Taiwan Union Technology Corporation, ITEQ, Shengyi Technology (600183), Huazheng New Material (603186), Jin'an Guojie (002636), and Nan Ya New Material (688519), among others. "With the rapid growth in demand from AI servers, automotive electronics (885545), and optical communication, CCL companies are experiencing a recovery. We recently returned from a visit to a CCL company; they are quite optimistic about the 2026 outlook. Due to urgent customer orders, they are not planning to shut down for the Spring Festival," the executive added. It is understood that CCL is the upstream material for manufacturing PCBs (Printed Circuit Boards (884092)), with final application scenarios including communication equipment (881129), automotive electronics (885545), consumer electronics (881124), and semiconductors (881121), etc. In the next 3-5 years, the growth in the PCB industry will be primarily driven by the dual engines of "AI computing infrastructure + automotive electronics (885545) intelligence." Simultaneously, advanced packaging (886009), edge AI hardware, high-frequency communication, and other fields will provide structural growth opportunities. The trend of the industry upgrading towards higher-end, high-value-added products is clear. Recently, due to a surge in AI server demand causing tight supply of high-end raw materials, global leader Resonac has announced a comprehensive price increase of over 30% for materials including Copper Foil Substrates (CCL), effective from March 2026. With the surge in demand from AI servers and new energy vehicles (850101), the global PCB market reached $88 billion in 2024. According to forecasts by consultancy Prismark, the global PCB market output value will grow by approximately 6.8% in 2025, and the PCB industry will continue to grow in the coming years, reaching around $94.661 billion by 2029, with a compound annual growth rate (CAGR) of about 5.2%. In terms of global capacity distribution, China has become the absolute leader, accounting for about 50% of global PCB capacity. The Pearl River Delta (Guangdong accounts for 40% of national capacity), Yangtze River Delta, and Bohai Rim form the three core manufacturing belts. Driven by cost factors, Southeast Asia (513730) has undertaken the transfer of some mid-to-low-end PCB capacity. Those closest to the water know the temperature first. The reporter noted that after a prolonged downturn of 2-3 years, upstream CCL companies are experiencing a strong recovery and have been reporting positive results in their annual performance forecasts. For example, Jin'an Guojie (002636) reported net losses after deducting non-recurring items of 110 million yuan and 82.36 million yuan in 2023 and 2024, respectively. However, by the second half of 2025, the company's performance accelerated, with full-year net profit expected to increase by 655.53%—871.4%. Huazheng New Material (603186) forecasts a net profit of 260-310 million yuan for 2025, compared to a net loss after deducting non-recurring items of 119 million yuan in the previous year. Nan Ya New Material (688519) reported a net profit of 158 million yuan for the first three quarters of 2025, exceeding the full-year profit of 50.32 million yuan from the previous year. Industry leader (883917) Shengyi Technology (600183) reported a net profit of 2.443 billion yuan for the first three quarters of 2025, already surpassing the full-year 2024 net profit of 1.739 billion yuan. It is noteworthy that while collectively reporting positive annual results, CCL companies have also successively announced new rounds of production expansion. On January 4th, Shengyi Technology (600183) disclosed that it has signed a 4.5 billion yuan investment intent agreement for a high-performance CCL project with the Dongguan Songshan Lake High-Tech Industrial Development Zone Management Committee. In December 2025, Nan Ya New Material (688519) disclosed a private placement plan, intending to raise approximately 900 million yuan to expand production of high-end CCLs. In November 2025, Jin'an Guojie (002636) disclosed a private placement plan, intending to raise 1.3 billion yuan for projects including high-grade CCLs. Core Materials Accelerating Domestic Substitution In the new round of expansion within the CCL industry, upstream core material suppliers are expected to accelerate domestic substitution. "In recent years, many domestic high-end resins and their core materials have made significant progress in product performance enhancement and are now able to substitute for foreign counterparts on an equal footing," the aforementioned resin company executive stated. "Perhaps sensing the crisis of domestic substitution, Daihachi Chemical Industry (850102) recently approached our company, hoping we would become their agent for phosphorus-based flame retardants, but we declined." The executive cited an example: "Currently, while producing resins, we are also the agent for two special phosphorus-based flame retardants from Wansheng Co., Ltd. (603010). Leveraging our company's existing channel advantages and the cost-effectiveness of Wansheng's own products, we have introduced their products to several CCL companies. Previously, the use of these special flame retardants by these companies was largely monopolized by foreign firms." Regarding these statements, the reporter reviewed the company's public information and found that it has already deployed two core products in the high-end PCB upstream material field at its Weifang base: flame retardants for CCLs and photosensitive resins for PCB photoresists (885864). A representative from Wansheng Co., Ltd. (603010) told the reporter that the company has formed diversified supply capabilities for multiple types of flame retardants and photosensitive resins for CCLs, continuously solidifying its competitive advantage. Benefiting from the continuous expansion of the downstream printed circuit board (PCB) manufacturing industry and increasing requirements for fire performance in electronic products, the global market demand for flame retardants used in epoxy CCLs is expected to show a rapid growth trend. Halogen-free phosphorus-based flame retardants, which can avoid harmful gases produced by halogen combustion and the potential carcinogenic risks associated with antimony-based flame retardants, and possess good thermal stability and flame retardant efficiency, are seeing a significantly increased application proportion in high-end CCLs. It is understood that resin types involved include electronic-grade epoxy resins, electronic-grade phenolic resins, etc. Among them, electronic-grade resins act like "property adjusters" for CCLs—different resins can enhance different characteristics of CCLs, and the upgrading of CCL characteristics in turn makes PCB performance better. For example, the polar group structure and curing method of the resin affect the copper foil peel strength and interlayer bonding force of the CCL, making PCB processing more reliable. The more bromine-based or phosphorus-based flame-retardant elements in the resin, the higher the flame retardant rating of the CCL. Special structures can also achieve low dielectric properties and intrinsic flame retardancy, meeting the needs for high-frequency signal transmission and high-speed information processing, widely used in next-generation servers, automotive electronics (885545), communication networks, and other fields. Taking high-frequency CCLs as an example, such products are "special receivers" for ultra-high-frequency signals, operating at frequencies over 5GHz, suitable for ultra-high-frequency scenarios. They require ultra-low dielectric constant (Dk) and as low as possible dielectric loss (Df). They are core materials for 5G base stations, autonomous driving (885736) millimeter-wave radars (886035), and high-precision satellite navigation (885574). To lower Dk, it mainly relies on modifying the insulating resin, glass fiber, and overall structure. Industry insiders believe that as the global electronics industry upgrades towards "halogen-free, high-performance, high-reliability," the performance requirements for PCB upstream materials (especially flame retardants and CCLs) continue to increase, providing new market opportunities for material companies with technological advantages. These companies will gain first-mover advantages in the domestic substitution within the mid-to-high-end markets. In particular, Wansheng Co., Ltd. (603010), having laid out in advance the two core product lines of flame retardants for CCLs and photosensitive resins for PCB photoresists, will fully enjoy the benefits of industry growth and domestic substitution. ---------------------------------- Source: Securities Times e Company Disclaimer: We respect originality and also value sharing; the copyright of text and images belongs to the original author. The purpose of reprinting is to share more information, which does not represent the position of this account. If your rights are infringed, please contact us promptly, and we will delete the content as soon as possible. Thank you.

In the SMT (Surface Mount Technology) production process, moisture sensitivity issues with PCBs and components directly affect soldering yield and product reliability. The Moisture Sensitivity Level (MSL) is the core indicator for defining protection standards. Coupled with standardized workshop storage conditions, it can effectively prevent production failures caused by moisture absorption. Why are PCBs afraid of moisture? What is the MSL rating? PCB substrates (such as FR-4) easily absorb moisture from the air. During the high temperatures of SMT reflow soldering (>220°C), internal moisture rapidly vaporizes and expands, which may lead to board delamination or micro-cracks in solder pads (known as the "popcorn" effect), resulting in electrical failure. The industry uses the Moisture Sensitivity Level (MSL) standard to quantify this risk, divided into levels 1–6. The higher the number, the more sensitive the component, and the shorter the allowable workshop exposure time: MSL Level 3: Must be soldered within 168 hours (7 days) after opening. MSL Level 6: Must be soldered within 24 hours and often requires baking for moisture removal before use. Storage and management specifications in SMT workshops are based on MSL requirements. Modern SMT workshops must establish a strict moisture-sensitive material control system: Incoming Storage: Clearly label materials with their MSL level and store them separately. Standard materials are stored in a controlled environment (typically temperature

Metal clad laminates and FR-4 are two commonly used substrate materials for printed circuit boards (PCBs) in the electronics industry. They differ in material composition, performance characteristics, and application areas.   Analysis of Metal Clad Laminate and FR-4 Metal Clad Laminate: This is a PCB material with a metal base, typically aluminum or copper. Its main feature is excellent thermal conductivity and heat dissipation capability, making it highly popular in applications requiring high thermal conductivity, such as LED lighting and power converters. The metal base effectively transfers heat from hotspots on the PCB to the entire board, reducing heat accumulation and improving the overall performance of the device.   FR-4: FR-4 is a laminate material that uses glass fiber cloth as the reinforcement and epoxy resin as the binder. It is the most widely used PCB substrate, favored for its good mechanical strength, electrical insulation properties, and flame-retardant characteristics, making it suitable for various electronic products. FR-4 has a flame-retardant rating of UL94 V-0, meaning it burns for a very short time when exposed to flames, making it suitable for electronic devices with high safety requirements.   Main Differences Between Metal Clad Laminate and FR-4 1. Base Material: Metal clad laminate uses metal (such as aluminum or copper) as the base, while FR-4 uses glass fiber cloth and epoxy resin. 2. Thermal Conductivity: Metal clad laminate has significantly higher thermal conductivity than FR-4, making it suitable for applications requiring effective heat dissipation. 3. Weight and Thickness: Metal clad laminate is generally heavier than FR-4 and may be thinner. 4. Processability: FR-4 is easy to process and suitable for complex multilayer PCB designs, while metal clad laminate is more challenging to process but ideal for single-layer or simple multilayer designs. 5. Cost: Metal clad laminate is typically more expensive than FR-4 due to the higher cost of metal. 6. Application Areas: Metal clad laminate is mainly used in electronic devices requiring good heat dissipation, such as power electronics and LED lighting. FR-4 is more versatile and suitable for most standard electronic devices and multilayer PCB designs.   In summary, the choice between metal clad laminate and FR-4 depends primarily on the product's thermal management requirements, design complexity, cost budget, and safety considerations. JDB PCB advises selecting materials based on the product's specific needs, as the most advanced material is not necessarily the most suitable.   ------------------------------ Copyright Notice: The copyright for the above text and images belongs to the original author(s). Bicheng shares this as a repost. If there are any copyright concerns, please contact us, and we will remove the content.

The demand for AI is driving a global expansion in Printed Circuit Board (PCB) production and the development of new manufacturing locations. Chinese manufacturers are actively establishing a presence in Thailand, while South Korean PCB companies, leveraging Samsung's longstanding operations in Vietnam, have made Malaysia a key expansion site for IC substrates in recent years. Japan is increasing investment to strengthen its ecosystem for advanced packaging and high-end PCBs, and Taiwanese PCB manufacturers have initiated a "China Plus One" strategy, shaping a new wave of production expansion.   On December 14, the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's Industrial Economics and Knowledge Center released the "2025 Mainland China PCB Industry Dynamic Observation" and the "2025 Japan and South Korea PCB Industry Observation" reports, analyzing the industrial shifts in East Asian PCB production bases in the AI era and the expansion into new locations.   TPCA pointed out that Mainland China is the world's largest PCB production base. In 2025, the output value of Mainland Chinese companies is expected to reach $34.18 billion, a year-on-year increase of 22.3%, with the global market share rising to 37.6%, demonstrating explosive growth momentum.   Mainland Chinese manufacturers are actively promoting overseas deployment. Thailand, with its favorable investment environment and well-developed infrastructure, has become the preferred destination for Mainland Chinese PCB manufacturers' capacity relocation. TPCA stated that the current estimated production value of Mainland Chinese-funded PCB factories in Thailand accounts for about 1.7% of their total output value. Although they may face challenges in the short term, such as rising local labor costs and low initial yield rates for new factories, the globalization strategy can mitigate geopolitical risks and attract new customers and market share in the long run.   Taiwan (China) is the world's second-largest PCB production base. Mainland China was once the primary production location for Taiwanese PCB companies. In recent years, affected by geopolitical risks, Taiwanese companies have successively launched a "China Plus One" strategy, establishing new bases in Taiwan and Southeast Asia. Currently, more than ten Taiwanese-funded PCB companies, including Compeq, Zhen Ding Technology, Unimicron, Chin-Poon, and Gold Circuit Electronics, have invested and set up factories in Thailand, with many now in mass production. Tripod focuses on Vietnam, while HannStar Board and GBM, under the PSA Group, have chosen Malaysia for their plants.   TPCA stated that Taiwan's (China) semiconductor and PCB industries play crucial roles in the global AI server supply chain. Facing changes in the new Asian landscape, Taiwan (China) needs to accelerate the deepening and strengthening of its capabilities in advanced packaging, high-end technology, and material autonomy while managing geopolitical and market risks to maintain its key role in the AI era's supply chain restructuring.   Japan is the world's third-largest PCB production base. TPCA noted that the output value of Japanese-funded companies in 2024 was approximately $11.53 billion, with a global market share of about 14.4%. It is estimated that Japan's PCB industry will return to positive growth in 2025, with the total domestic and overseas output value expected to rise to $11.82 billion, reaching $12.35 billion in 2026.   Furthermore, TPCA indicated that Japan is not only relying on corporate investment to boost production capacity but also aligning with the government's recent national strategies for AI and semiconductors. Through institutionalized subsidies, dedicated funding systems, and supply chain security strategies, Japan aims to enhance its overall competitiveness in the advanced packaging and high-end PCB ecosystem.   South Korea ranks fourth in the global PCB market. TPCA reported that the total domestic and overseas output value of South Korean-funded enterprises in 2024 was approximately $7.86 billion, accounting for a 9.8% market share. The South Korean industry is expected to experience stable and moderate growth from 2025 to 2026, with projected total output values of $7.94 billion and $8.16 billion, respectively.   Regarding overseas deployment, TPCA pointed out that South Korean PCB companies, benefiting from Samsung's established supply chain in Vietnam over the years, have made Malaysia a primary expansion base for IC substrates in recent years, actively increasing BT substrate capacity to meet subsequent memory market demand. TPCA analyzed that South Korea will continue to play a significant role in memory and server platforms and maintain its strategic position in the global PCB supply chain through high-end substrate technology.   ------------------------------------ Source: TPCA Copyright Notice: The copyright for the above text and images belongs to the original author(s). We share this as a repost. If there are any copyright concerns, please contact us, and we will remove the content.

The performance of radio frequency (RF) and high-speed digital circuits is intrinsically linked to the substrate material and construction of the printed circuit board (PCB). The presented board exemplifies how advanced hydrocarbon ceramic materials can be leveraged to achieve superior signal integrity and thermal performance while maintaining compatibility with standard PCB processing techniques. 1. Introduction As operational frequencies in communication and computing systems continue to escalate, the electrical properties of the PCB substrate become a dominant factor in system performance. Traditional FR-4 materials exhibit excessive loss and unstable dielectric constant at microwave frequencies, necessitating the use of specialized low-loss laminates. The following technical analysis focuses on a specific implementation using Rogers Corporation's RO4003C LoPro series, a material engineered to provide an optimal balance of high-frequency performance, thermal management, and manufacturability. 2. Material Selection: RO4003C LoPro Laminate The core of the design is the RO4003C LoPro laminate, a hydrocarbon ceramic composite. Its selection is justified by several key characteristics: Stable Dielectric Constant: A tight tolerance of 3.38 ± 0.05 at 10 GHz ensures predictable impedance control across the board and over varying environmental conditions. Low Dissipation Factor: At 0.0027, the material minimizes dielectric loss, which is critical for maintaining signal strength and integrity in applications exceeding 40 GHz. Enhanced Thermal Performance: The laminate features a high thermal conductivity of 0.64 W/m/K and a glass transition temperature (Tg) exceeding 280°C, ensuring reliability during lead-free assembly and in high-power operational environments. Low-Profile Copper: The "LoPro" designation refers to the use of reverse-treated foil, which creates a smoother conductor surface. This reduces conductor loss and dispersion, directly improving insertion loss compared to standard electrodeposited copper foils. A significant advantage of the RO4003C material system is its compatibility with standard FR-4 multilayer lamination and processing procedures, eliminating the need for costly via pre-treatments and thereby reducing overall manufacturing cost and complexity. 3. PCB Construction and Stack-up The board is a 2-layer rigid construction with the following detailed stackup: Layer 1: 35 µm (1 oz) rolled copper foil. Dielectric: Rogers RO4003C LoPro core, 0.526 mm (20.7 mil) thick. Layer 2: 35 µm (1 oz) rolled copper foil. The finished board thickness is 0.65 mm, indicating a thin-profile build suitable for compact assemblies. The construction details reflect a design optimized for high yield and performance: Critical Dimensions: Minimum trace/space of 5/5 mil and a minimum drilled hole size of 0.3 mm demonstrate a design rule set that is readily achievable while supporting a moderate level of routing density. Surface Finish: The specification of silver underplating with gold plating (often referred to as "hard" or "electrolytic" gold) is indicative of an RF design. This finish provides excellent surface conductivity for high-frequency currents, low contact resistance for connectors, and superior environmental robustness. Via Structure: The board utilizes 39 through-hole vias with a plating thickness of 20 µm, ensuring high reliability for interlayer connections. The absence of blind vias simplifies the fabrication process. 4. Quality and Standards The PCB layout data was supplied in Gerber RS-274-X format, ensuring accurate and unambiguous data transfer to the manufacturer. The board was fabricated and tested to IPC-A-600 Class 2 standards, which is the typical benchmark for commercial and industrial electronics where extended life and performance are required. Quality Assurance: A 100% electrical test was performed post-manufacturing, verifying the integrity of all connections and the absence of shorts or opens. 5. Application Profile The combination of material properties and construction details makes the PCB suitable for a range of high-performance applications, including: Cellular base station antennas and power amplifiers, where low passive intermodulation (PIM) is critical. Low-noise block downconverters (LNBs) in satellite reception systems. Critical signal paths in high-speed digital infrastructure, such as server backplanes and network routers. High-frequency RF identification (RFID) tags. 6. Conclusion The analyzed PCB serves as a practical case study in the effective application of Rogers RO4003C LoPro laminate. The design leverages the material's stable electrical properties, low loss profile, and excellent thermal characteristics to meet the demands of modern high-frequency circuits. Furthermore, the fabrication specifications demonstrate that such high performance can be achieved without resorting to exotic or prohibitively expensive manufacturing processes.

Introduction The F4BTMS series is an upgraded version of the F4BTM series. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants.   The incorporation of ultra-thin, ultra-fine fiberglass cloth reinforcement, along with a precise blend of special nanoceramics and polytetrafluoroethylene resin, minimizes electromagnetic wave interference, reducing dielectric loss and enhancing dimensional stability.   F4BTMS exhibits reduced anisotropy in the X/Y/Z directions, enabling higher frequency usage, increased electrical strength, and improved thermal conductivity.   Features F4BTMS material offers a wide range of dielectric constants, providing flexible options from 2.2 to 10.2, while maintaining a stable value throughout.   Its dielectric loss is extremely low, ranging from 0.0009 to 0.0024, minimizing energy dissipation and improving overall system efficiency.   F4BTMS exhibits excellent temperature coefficient of dielectric constant. The TCDK with a DK value ranging from 2.55 to 10.2, remains within 100 ppm/℃.   The CTE values in the X and Y directions are between 10-50 ppm/°C , while in the Z direction, it is as low as 20-80 ppm/°C. This low thermal expansion ensures exceptional dimensional stability, enabling reliable hole copper connections.   F4BTMS demonstrates remarkable resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation; and low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.   PCB capability We offer a wide range of PCB manufacturing capabilities, allowing you to choose the best options for your needs.   We can accommodate various layer counts, including Single Sided, Double Sided, Multilayer, and Hybrid PCBs.   You can select from different copper weights, such as 1oz (35µm) and 2oz (70µm).   We offer a diverse selection of dielectric thicknesses, ranging from 0.09mm (3.5mil) to 6.35mm (250mil).   Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, catering to designs of different scales.   Various solder mask colors are available, such as Green, Black, Blue, Yellow, Red, and more.   Moreover, we provide diverse surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold and ENEPIG etc.   PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz) F4BTMS220 2.2±0.02 0.0009 F4BTMS233 2.33±0.03 0.0010 F4BTMS255 2.55±0.04 0.0012 F4BTMS265 2.65±0.04 0.0012 F4BTMS294 2.94±0.04 0.0012 F4BTMS300 3.0±0.04 0.0013 F4BTMS350 3.5±0.05 0.0016 F4BTMS430 4.3±0.09 0.0015 F4BTMS450 4.5±0.09 0.0015 F4BTMS615 6.15±0.12 0.0020 F4BTMS1000 10.2±0.2 0.0020 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications F4BTMS PCBs have extensive applications across various domains, including Aerospace and aviation equipment, Microwave and RF applications, Radar systems, Signal distribution feed networks, Phase-sensitive antennas and phased array antennas etc.

Introduction Wangling’s TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. Features The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The material demonstrates low dielectric loss, with a slight increase at higher frequencies. However, this increase is not significant within the 10 GHz range. For long-term operation, the material can withstand temperatures ranging from -100°C to +150°C, showcasing excellent low-temperature resistance. It's important to note that temperatures exceeding 180°C may result in deformation, copper foil peeling, and significant changes in electrical performance. The material exhibits radiation resistance and displays low outgassing properties. Furthermore, the adhesion between the copper foil and dielectric is more reliable compared to ceramic substrates with vacuum coating. PCB Capability Let’s see our PCB Capability on TP materials. Layer count: We offer single-sided and double-sided PCBs based on the characteristics of the material. Copper weight: We provide options of 1oz (35µm) and 2oz (70µm), catering to different conductivity requirements. Wide range of dielectric thicknesses are available, such as 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, and 12.0mm, allowing flexibility in design specifications. Due to laminate size constraints, the maximum PCB we can provide is 150mm X 220mm. Solder mask: We offer various solder mask colors, including green, black, blue, yellow, red, and more, enabling customization and visual distinction. Our surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements. PCB Material: Polyphenylene, ceramic Designation (TP Series) Designation DK DF TP300 3.0±0.06 0.0010 TP440 4.4±0.09 0.0010 TP600 6.0±0.12 0.0010 TP615 6.15±0.12 0.0010 TP920 9.2±0.18 0.0010 TP960 9.6±0.2 0.0011 TP1020 10.2±0.2 0.0011 TP1100 11.0±0.22 0.0011 TP1600 16.0±0.32 0.0015 TP2000 20.0±0.4 0.0020 TP2200 22.0±0.44 0.0022 TP2500 25.0±0.5 0.0025 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤150mm X 220mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications Displayed on the screen is a TP high-frequency PCB with a thickness of 1.5mm, featuring OSP coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas etc.

Introduction Wangling’s TF laminates are a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. These laminates are free from fiberglass cloth and the dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. With the application of special production processes, they demonstrate outstanding dielectric performance and offer a high level of reliability. Features TF laminates exhibit a stable and wide range of dielectric constant, which ranges from 3 to 16, with common values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16. TF laminates feature exceptionally low dissipation factor, with loss tangent values of 0.0010 for DK ranging from 3.0 to 9.5 at 10GHz, 0.0012 for DK from 9.6 to 11.0 at 10GHz, and 0.0014 for DK spanning 11.1 to 16.0 at 5GHz. With a long-term working temperature surpassing TP materials, they can operate within a wide range of -80°C to +200°C The laminates come in thickness options ranging from 0.635mm to 2.5mm, catering to various design requirements. They boast resistance to radiation and exhibit low outgassing properties. PCB Capability We provide a comprehensive range of PCB manufacturing capabilities to fulfill your specific requirements. At first, we can accommodate both Single Sided and Double Sided PCBs. Then you have the option to select from different copper weights, such as 1oz (35µm) and 2oz (70µm), to meet your conductivity needs. A diverse selection of dielectric thicknesses are available in our house, ranging from 0.635mm to 2.5mm. Our manufacturing capabilities support PCB sizes up to 240mm X 240mm and various solder mask colours like Green, Black, Blue, Yellow, Red, and more. Additionally, we offer various surface finish options, including Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, and ENEPIG etc. PCB Material: Polyphenylene, ceramic Designation (TF Series) Designation DK DF TF300 3.0±0.06 0.0010 TF440 4.4±0.09 0.0010 TF600 6.0±0.12 0.0010 TF615 6.15±0.12 0.0010 TF920 9.2±0.18 0.0010 TF960 9.6±0.19 0.0012 TF1020 10.2±0.2 0.0012 TF1600 16.0±0.4 0.0014 Layer count: Single Sided, Double Sided PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (Dielectric thickness or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm PCB size: ≤240mm X 240mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. Applications TF high-frequency PCBs are utilized in applications of microwave and millimeter-wave domains, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.

Introduction Wangling’s F4BTM series laminates are fiberglass cloth, nano-ceramic fillers, and PTFE resin, followed by strict pressing processes. They are based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.   F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.   Features F4BTM offers a wide range of features. With a DK range from 2.98 to 3.5, it provides flexibility in design. The addition of ceramics further enhances its performance, making it suitable for demanding applications. This material is available in various thicknesses and sizes, catering to different project requirements while offering cost savings. Its commercialization and suitability for large-scale production make it a highly cost-effective choice. Additionally, F4BTM exhibits radiation-resistant and low out-gassing properties, ensuring its reliability even in challenging environments.   PCB Capability Our PCB manufacturing capabilities cover a wide range of options. We can handle various layer counts, including single-sided, double-sided, multilayer, and hybrid PCBs.   For copper weight, we offer options of 1oz (35µm), and 2oz (70µm), allowing flexibility in conductivity requirements.   When it comes to dielectric thickness (or overall thickness), we provide a comprehensive selection of options ranging from 0.25mm to 12.0mm, catering to different design specifications.   The maximum PCB size we can accommodate is 400mm X 500mm, ensuring sufficient space for your project.   We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual distinction.   Regarding surface finish, we support several options such as bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and more, ensuring compatibility with your specific requirements.   PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz) F4BTM298 2.98±0.06 0.0018 F4BTM300 3.0±0.06 0.0018 F4BTM320 3.2±0.06 0.0020 F4BTM350 3.5±0.07 0.0025 Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..   Applications The screen displays a DK 3.0 F4BTM PCB, constructed on a 1.524mm substrate and featuring HASL surface finishes.   F4BTM PCBs are utilized in various applications, including Antenna, Mobile Internet, Sensor Network, Radar, Millimeter Wave Radar, Aerospace, Satellite Navigation, and Power Amplifier etc.

Brief introduction RO3203 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while remaining cost-effective. As an extension of the RO3000 series, RO3203 materials stand out with their enhanced mechanical stability.   With a dielectric constant of 3.02 and a dissipation factor of 0.0016, RO3203 materials enable an extended useful frequency range beyond 40 GHz.   Features RO3203 has a thermal conductivity of 0.48 W/mK, indicating its ability to conduct heat.   The volume resistivity is 107 MΩ.cm and surface resistivity of the material is also 107 MΩ.   RO3203 exhibits a dimensional stability of 0.8 mm/m in the X and Y directions and it has a moisture absorption rate of less than 0.1%, indicating its ability to resist absorbing moisture when exposed to specific conditions.   The material has different coefficients of thermal expansion in three directions. The Z-direction coefficient is 58 ppm/℃, while the X and Y-direction coefficients are both 13 ppm/℃.   RO3203 has a Thermal Decomposition Temperature (Td) of 500℃ and a density of 2.1 gm/cm3 at 23℃.   After soldering, the material exhibits a copper peel strength of 10.2 lbs/in and a flammability rating of V-0 according to the UL 94 standard, while also being compatible with lead-free processes.   Property RO3203 Direction Units Condition Test Method Dielectric Constant,εProcess 3.02±0.04 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 3.02 Z - 8 GHz - 40 GHz Differential Phase Length Method Dissipation Factor, tan d 0.0016 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Thermal Conductivity 0.48   W/mK Float 100℃ ASTM C518 Volume Resistivity 107   MΩ.cm A ASTM D257 Surface Resistivity 107   MΩ A ASTM D257 Dimensional Stability 0.8 X, Y mm/m COND A IPC-TM-650 2.4.3.9 Moisure Absorption