quality RF PCB Board & Rogers PCB Board factory

High-frequency PCBs, such as those utilizing materials like TP1020, demand a set of specialized manufacturing processes to ensure optimal performance in applications operating at 10GHz and beyond. Unlike standard FR-4 based PCBs, these high-performance substrates require meticulous control over every production stage to maintain electrical integrity, dimensional stability, and material properties.   Material Handling & Preparation The unique composition of high-frequency materials like TP1020—ceramic-filled polyphenylene oxide (PPO) resin without fiberglass reinforcement—necessitates specialized handling protocols. Prior to lamination, the raw material must be stored in a controlled environment with humidity levels below 30% and temperature maintained at 23±2°C. This prevents moisture absorption (critical given TP1020's 0.01% maximum absorption rate) which can cause dielectric constant variations exceeding ±0.2 at 10GHz.   Cutting and trimming operations require diamond-tipped tools rather than standard carbide blades. The absence of fiberglass reinforcement in TP1020 makes the material prone to chipping if subjected to excessive mechanical stress, potentially creating micro-fissures that degrade signal integrity. Laser cutting, while more expensive, is preferred for achieving the ±0.15mm dimensional tolerances required for 31mm x 31mm boards used in miniaturized antennas.   Lamination & Core Processing High-frequency laminates demand precise lamination parameters to maintain dielectric consistency. For TP1020, the lamination process operates at 190±5°C with a pressure of 200±10 psi, significantly lower than the 300+ psi used for fiberglass-reinforced materials. This lower pressure prevents ceramic particle displacement within the PPO matrix, ensuring the targeted dielectric constant of 10.2 is maintained across the entire board surface.   The 4.0mm core thickness of TP1020 PCBs requires extended dwell times during lamination—typically 90 minutes compared to 45 minutes for standard substrates. This controlled heating cycle ensures complete resin flow without creating internal voids, which would act as signal reflection points at high frequencies. Post-lamination cooling must proceed at a rate of 2°C per minute to minimize thermal stress, critical for managing TP1020's CTE of 40ppm/°C (X/Y-axis). Drilling & Plating Techniques Drilling high-frequency PCBs presents unique challenges due to the abrasive nature of ceramic fillers in materials like TP1020. Standard twist drills wear prematurely, leading to hole wall roughness exceeding 5μm—unacceptable for high-frequency signal paths. Instead, diamond-coated drill bits with a 130° point angle are required to achieve the 0.6mm minimum hole size with wall roughness

In the complex structure of a Printed Circuit Board (PCB), pads, which may seem like inconspicuous metal dots or polygons, play a crucial role in sustaining the life of the circuit. As the "bridge" between the PCB and electronic components, the design and performance of pads directly determine the stability, reliability, and service life of the entire electronic device, and their importance far exceeds what meets the eye.   From the perspective of connection function, pads are the core carriers for achieving electrical conduction. When components are fixed on the PCB through welding processes, pads form conductive paths with component pins via molten solder, transmitting current and signals from one component to another, and ultimately forming a complete circuit system. Whether it is simple resistors and capacitors or complex integrated circuits, they must rely on pads to establish electrical connections with the PCB. Once pads are detached, oxidized, or have design defects, it will lead to faults such as open circuits and short circuits, directly causing circuit functional failure.   In terms of mechanical support, pads also play an irreplaceable role. During the welding process, after the solder solidifies, it will firmly fix the components on the PCB surface. Pads, through close combination with the solder, provide stable mechanical support for the components, preventing them from displacement or falling off under the influence of environmental factors such as vibration, impact, or temperature changes. Especially for larger and heavier components (such as transformers, connectors, etc.), the size, shape, and distribution design of pads directly affect the installation firmness of the components, which in turn relates to the mechanical resistance performance of the device.   The rationality of pad design has a profound impact on circuit performance. In high-frequency circuits, the size, shape, and spacing of pads will affect impedance matching and signal integrity. Excessively large pads may lead to an increase in parasitic capacitance, while excessively small ones may cause impedance mutations, resulting in signal reflection, attenuation, or crosstalk. In power circuits, pads need to have sufficient current-carrying capacity. If the area is insufficient, it will lead to excessive current density, causing local overheating and even burning the circuit. In addition, the connection method between pads and wires (such as whether to adopt a teardrop design) will also affect the fatigue resistance of the PCB, reducing the risk of wire breakage caused by thermal expansion and contraction.   From the perspective of manufacturing, the design of pads is directly related to the feasibility and efficiency of the welding process.   Standardized pad sizes and spacings can adapt to automated welding equipment (such as placement machines, wave soldering furnaces), reducing the rate of welding defects. A reasonable pad layout can avoid problems such as solder bridging and cold soldering, reducing the cost of manual repair. At the same time, the plating quality of pads (such as gold plating, tin plating) will affect the wettability and reliability of welding, which in turn determines the qualification rate and service life of the product.   To sum up, pads are the core hub connecting electricity and machinery in the PCB. Their importance is reflected in multiple dimensions such as maintaining circuit conduction, ensuring structural stability, optimizing circuit performance, and improving production reliability. With the development trend of electronic devices towards miniaturization, high frequency, and high reliability, the design and manufacturing process of pads will become one of the key factors determining product competitiveness, always playing the important role of "small components, great functions".

AI glasses are rapidly driving new demand in the wearable market. Major international companies like Meta and Apple are accelerating their product launches, and several startups in China are also entering the fray. The supply chain for AI glasses, including sensing and lens modules, is generating new momentum and benefiting HDI, flexible circuit board, rigid-flex board, and substrate manufacturers, making AI glasses a focal point in the wearable device sector.   Huatong currently focuses on mid to high-end HDI boards for AI glasses applications and is simultaneously developing flexible and rigid-flex boards, creating a complete product lineup. Although current shipments have not significantly contributed to revenue, growth is evident, and the company has entered stable mass production. Clients include several international brands like Meta, and many startups in China are actively developing AI glasses. The lightweight and compact nature of AI glasses increases the demand for high-end printed circuit boards, which is advantageous for the company to expand its share of high-end applications.   Zhen Ding is one of the earliest PCB manufacturers to enter the smart glasses field, now offering a complete product line that includes flexible boards, SiP modules, and rigid boards. Zhen Ding reports that its global market share for printed circuit boards used in smart glasses has reached 30-50%. Although this year's shipments have not peaked, the scale has grown several times compared to last year. With high technical barriers and premium pricing, the gross margin for this business is already above the company’s overall average and is expected to continue improving profitability.   Taiwan's Jeng Yi has been actively entering the wearable device market in recent years, and its new generation of products for AI glasses has completed mass production introduction, with initial results gradually emerging. The company estimates that shipments will grow significantly in 2026, further boosting operational momentum.   In upstream materials, PI manufacturer Damao is targeting Meta glasses with transparent PI. Damao provides films, while its subsidiary Bo Mi Lan specializes in fine circuits, enabling smart glasses to achieve eye-tracking functionality. The company plans to continue its strategic positioning in the AI glasses market.   ------------------------------------ Source: Money DJ Disclaimer: We respect originality and focus on sharing. The text and images are copyrighted by the original authors. The purpose of reprinting is to share more information and does not represent our position. If your rights are infringed, please contact us promptly, and we will delete it immediately. Thank you.

According to CCTV News, on July 31 local time, U.S. President Trump signed an executive order, setting "reciprocal tariff" rates on imports from multiple countries and regions, with specific rates ranging from 10% to 41%. This tariff list officially took effect at 00:00 on August 7. President Trump's latest tariff plan will impose tariffs higher than 10% on imported goods from approximately 40 countries.   Regarding the impact of the U.S. imposing reciprocal tariffs on electronic products, Li Dingzhuan, Chief Operating Officer of Zhen Ding, stated in an interview on August 12 before hosting an online earnings conference that tariffs have brought challenges to the global supply chain, especially the printed circuit board (PCB) industry, which mainly targets the U.S. market, facing greater uncertainty. However, according to the company's research, despite the pressure from tariff measures, the PCB industry still shows strong resilience and continues to drive growth momentum through technological innovation and diversified market layout.   Li Dingzhuan said that currently, the U.S. market accounts for about 35% of most electronic products, and the remaining 65% are distributed in other international markets, which enables the industry to partially diversify tariff risks. He emphasized that after the Trump administration announced the reciprocal tariff rates for various countries in August, there has been no significant impact on major customers' orders and overall production capacity, and market demand remains stable.   It is worth noting that emerging applications such as AI phones, smart glasses, and humanoid robots have become important drivers of PCB demand. These innovative products not only put forward higher requirements for PCB technical specifications but also continue to double the related output value. The industry generally believes that these emerging fields can make up for potential fluctuations caused by tariffs in the traditional consumer electronics market.   Shen Qingfang, Chairman of Zhen Ding, said that the integration and technological upgrading of the PCB industry chain are the keys to coping with tariff challenges. From material selection, process optimization to the introduction of intelligent manufacturing, all help to improve production efficiency and product added value, thereby consolidating international competitiveness.   Looking to the future, Shen Qingfang emphasized that although there are still variables in the global trade environment, the industry's confidence remains stable. Industry players will continue to focus on high-end technologies and diversified application fields, strengthen international cooperation, and actively expand non-U.S. markets to inject more growth momentum into overall operations.   According to previous announcements, Zhen Ding's cumulative consolidated revenue in the first seven months reached 91.638 billion New Taiwan dollars, a year-on-year increase of 16.91%, setting a new record for the same period in previous years. Zhen Ding explained that exchange rate fluctuations led to a slight year-on-year decrease in revenue denominated in New Taiwan dollars, but driven by customers' stockpiling demand, revenue in July showed a double-digit year-on-year increase in U.S. dollars. Among them, IC substrate revenue continued to grow, and the stockpiling period for new mobile communication and consumer electronics products has begun, with the overall performance still in line with expectations.   Observing the product structure, Zhen Ding's IC substrate revenue share is expected to increase from 3.3% last year to 5.2% this year, and further expand to a high single-digit level next year. The ABF substrates, which have been cultivated for many years, have seen a stable increase in the utilization rate of the Shenzhen factory, and the new Kaohsiung factory is also scheduled to start operation in 2026, which will help optimize supply momentum and customer portfolio simultaneously. In addition, the demand for AI servers and emerging applications continues to increase, and the revenue contribution of related businesses is expected to rise to 7% - 8%, becoming one of the core growth drivers in the next two years.   Although Zhen Ding's cumulative revenue has increased by more than 10% year-on-year, profits are still challenged by exchange rate and raw material cost fluctuations. It is estimated that every 1% change in the exchange rate will affect the gross profit margin by approximately 0.2 - 0.3 percentage points. However, with the start of the peak season for mobile phones, the increase in the proportion of high-end products, and the production capacity distributed in mainland China, Taiwan China, Thailand, etc., which have flexibility in responding to exchange rate and geopolitical risks, the gross profit margin is expected to rise to 20% in the third quarter, and the profit structure in the second half of the year is expected to improve significantly.   Looking ahead, institutional investors predict that Zhen Ding will continue the momentum of the consumer electronics peak season and benefit from the growth in ASP of high-end products driven by the rising penetration rate of AI applications. The annual revenue is expected to exceed 180 billion New Taiwan dollars, a year-on-year increase of nearly 10%. With the continuous advancement of substrate market share and the upgrading of revenue structure driven by capacity expansion, the upward trend will continue next year.     -----------------------------------   Source: United Daily News, Commercial Times Statement: We respect originality and also pay attention to sharing; the copyright of words and pictures belongs to the original author. The purpose of reprinting is to share more information, and does not represent the position of this account. If your rights are infringed, please contact us in time, and we will delete it as soon as possible. Thank you.

On August 8, Bloomberg reported, citing informed sources, that Tesla Inc. will disband its Dojo supercomputer team, and the team leader will leave the company. This move may disrupt Tesla's plan to develop self-designed chips for autonomous driving technology.   Informed sources stated that Peter Bannon, who is in charge of the Dojo project, will resign. Tesla CEO Elon Musk has ordered the closure of the project. Recently, about 20 members of the Dojo team have moved to the newly established DensityAI, while the remaining Dojo employees have been reassigned to other data center and computing projects within Tesla.   Tesla plans to increase its reliance on external technology partners, including adopting computing technologies from NVIDIA and AMD, as well as chip manufacturing services from Samsung Electronics.   This decision marks a major shift in Tesla's project that has been under development for years. Dojo was once regarded as the core of Tesla's multi-billion-dollar plan, which aimed to enhance Tesla's computing power in the AI competition.   Dojo is a supercomputer independently designed by Tesla, used to train the machine learning models behind the company's Autopilot, Full Self-Driving systems, and its humanoid robot Optimus. The computer can receive data collected by vehicles and process it quickly to improve the company's algorithm performance. Analysts have pointed out that Dojo could become a significant competitive advantage for Tesla. Morgan Stanley predicted in 2023 that it might increase Tesla's market value by $500 billion.   However, Musk has hinted at a strategic shift during Tesla's recent quarterly earnings call. He said at the time that Tesla's future self-developed technologies might converge with those of its partners. He stated in the July 23 call: "Intuitively, for Dojo 3 and the AI6 inference chip, we want to converge them into essentially the same chip."   Musk also admitted last year that the company might not push forward with the Dojo project and would instead rely more on external partners.     --------------------------------   Source: Jiangnan Metropolis Daily, integrated with Cailianshe and Phoenix Tech Statement: We respect originality and also value sharing; the copyright of texts and images belongs to the original authors. The purpose of reprinting is to share more information and does not represent the position of this account. If your rights are infringed, please contact us promptly, and we will delete the relevant content as soon as possible. Thank you.

Introduction Wangling’s TFA300 high frequency material utilizes a large amount of uniform special nano-ceramics mixed with PTFE resin, eliminating the fiberglass effect during the propagation of electromagnetic waves.   A new manufacturing process is employed to create prefabricated sheets, which are pressed using a special lamination process. This material exhibits outstanding electrical, thermal, and mechanical properties with excellent dielectric constant at the same level, making it an aerospace-grade high-frequency and high-reliability material that can replace similar foreign products.   Features TFA300 features a low dielectric constant of 3 at 10GHz, enabling minimal signal delay and optimal impedance control for high-speed/high-frequency applications (e.g., 5G, radar, mmWave circuits).   Ultra-low dissipation factor of 0.001 at the same frequency ensures minimal signal loss and high-quality signal integrity in RF/microwave PCBs and antennas.   It also features a great TCDk value of -8 PPM/℃,providing exceptional dielectric constant stability across a wide temperature range (-40°C to +150°C), critical for automotive, aerospace, and outdoor telecom systems.   The peel strength is greater than 1.6N/mm, indicating superior adhesion between copper layers and substrate, reducing delamination risks in multilayer PCBs.   18 PPM/ºC of X/Y axis CTE, closely matching copper’s CTE of 17 ppm/°C, minimizes the stress-induced warpage during thermal cycling. 30 ppm/°C of Z axis, balances rigidity and flexibility for reliable plated through-hole (PTH) integrity.   TFA300 also shows low water absorption of 0.04%, a higher thermal conductivity of 0.8W/MK.   Finally, it meets the flammability standard of UL-94 V-0.   PCB Material: Nano-ceramics mixed with PTFE resin Designation: TFA300 Dielectric constant: 3 ±0.04 Dissipation factor: 0.001 Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 5mil (0.127mm), 10mil (0.254mm),20mil(0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm),50mil(1.27mm), 60mil(1.524mm),75mil(1.905mm), 80mil(2.03mm), 100mil(2.54mm), 125mil(3.175mm),150mil(3.81mm), 160mil(4.06mm), 200mil(5.08mm), 250mil(6.35mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple, etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..   PCB Capability We specialize in delivering high-quality TFA300 PCBs tailored to meet your diverse design and performance requirements.   Layer Count: We can provide you with Single-sided, Double-sided, Multi-layer and Hybrid PCBs (mixed materials).   Copper Weight: You can choose 1oz (35µm) for standard signal integrity, or 2oz (70µm) for enhanced current-carrying capacity and thermal management.   Dielectric Thickness: We offer extensive options from 5mil (0.127mm) to 250mil (6.35mm), enabling precise impedance control and adaptability for high-frequency applications.   PCB Size: We can supply a large panel up to 400mm x 500mm with single board or multiple designs.   Solder Mask Colors: It’s available in Green, Black, Blue, Yellow, Red, and more.   Surface Finishes: Immersion Gold (ENIG), HASL (Lead-Free),Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare copper and Pure Gold are available in house.   Applications TFA300 PCBs are typically used in aerospace and aviation equipment, phase-sensitive antennas, airborne radar, Satellite communication, and navigation etc.

Introduction RO3206 high frequency circuit materials are laminates that contain ceramic fillers and are reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while maintaining competitive pricing. They are an extension of the RO3000 series high frequency circuit materials, with the notable improvement of enhanced mechanical stability.   Features &Benefits: RO3206 stands out for its exceptional circuit material properties.   With a dielectric constant of 6.15 and tight tolerance at 10 GHz/23°C, it delivers superior electrical performance.   The low dissipation factor of 0.0027 at 10GHz minimizes signal loss, coupled with a high thermal conductivity of 0.67 W/MK for efficient heat dissipation.   With less than 0.1% low moisture absorption and a well-matched copper coefficient of thermal expansion (CTE) of 13, 13, and 34 ppm/°C across all axes, RO3206 ensures functional stability within intricate multi-layer structures and compatibility with epoxy multilayer board hybrid designs The woven glass reinforcement enhances rigidity, making it easier to handle during manufacturing.   Furthermore, the material's surface smoothness allows for precise PCB designs with fine line etching tolerances.   PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass Designation: RO3206 Dielectric constant: 6.15 Dissipation factor: 0.0027 Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness: 25mil (0.635mm), 50mil (1.27mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red, Purple etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..   PCB Capability I'm excited to introduce you to the remarkable PCB capabilities we offer for RO3206.   First up. let's talk about layer count. The options of Single Sided, Double Sided, Multi-layer PCB, and Hybrid PCB catering to your various design requirements.   Next, consider the copper weight. The choices of 1oz (35µm) and 2oz (70µm) providing flexibility for different applications.   Move on to dielectric thickness. Variants of 25mil (0.635mm) and 50mil (1.27mm) allowing for customization based on design specifications.   In terms of size, we can support up to 400mm X 500mm, accommodating a range of board dimensions.   We have a variety of solder mask color options. You can choose from Green, Black, Blue, Yellow, Red, and more.   Finally, let's discuss surface finishes. We offer a comprehensive selection, including Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, and Pure gold plated.   Applications RO3206 PCBs find applications across a diverse range of industries, including automotive GPS antennas, base station infrastructure, direct broadcast satellites, cable data links, microstrip patch antennas and so on.

Introduction Antenna-grade laminates of RO4725JXR are composed of a hydrocarbon, ceramic, and woven glass composite. The resin system of the dielectric materials provides essential properties for optimal antenna performance. RO4725JXR is fully compatible with traditional FR-4 and high-temperature lead-free solder processing. Unlike conventional PTFE-based laminates, RO4725JXR does not require special treatment for plated through-hole preparation. This makes it a cost-effective alternative to traditional PTFE-based antenna materials, enabling designers to achieve a balance between cost and performance.   Features RO4725JXR showcases distinctive attributes:   Low Dielectric Constant: With a precise value of 2.55 ± 0.05 at 10GHz, signal propagation is optimized. Consistent signal transmission and reception are ensured by a stable dielectric constant.   Low Z-axis CTE: Maintaining stability, the coefficient stands at 25.6 ppm/°C, preventing material expansion or contraction amidst temperature fluctuations.   Low TCDk: The +34 ppm/°C TCDk guarantees a stable dielectric constant across varying temperatures.   Low Dissipation Factor: At 10GHz, the 0.0026 dissipation factor minimizes energy loss as heat during signal transmission.   High Tg: With a Tg exceeding 280°C, the material retains its physical properties even under high-temperature conditions.   Reduced PIM Value: Notably, RO4725JXR boasts a reduced passive inter-modulation (PIM) value of -166 dBC, enhancing antenna performance, particularly in high-power scenarios.   PCB Material: Hydrocarbon / Ceramic / Woven Glass Designation: RO4725JXR Dielectric constant: 2.55 @ 10 GHz Dissipation factor: 0.0026 @10 GHz Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 30.7 mil (0.780mm), 60.7mil (1.542mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Red,Yellow, White etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare Copper, OSP, ENEPIG, Pure gold etc..   PCB Capability Let's dive into our PCB capabilities, where a vast array of options awaits to cater to every customer's unique requirements   From single-sided to double-sided, multi-layer, and hybrid PCBs, we offer a spectrum of choices suitable for applications ranging from basic electronics to intricate communication systems. Dielectric thicknesses like 30.7 mil and 60.7 mil are available to suit diverse needs, ensuring flexibility in design and adaptation to varying signal demands.   The copper weight is also adjustable based on your preferences. Whether it's 1oz (35 µm) or 2oz (70 µm), we customize to optimize the PCB's electrical performance.   Our PCBs come in sizes up to 400 mm by 500 mm, perfect for a multitude of applications. The large size allows for the integration of multiple components and systems, providing greater flexibility in design.   We offer a variety of solder mask colors, including green, black, blue, red, yellow, and white among others.   In addition, our PCBs can be finished with a range of surface finishes, such as immersion gold, HASL, immersion silver, immersion tin, bare copper, OSP, ENEPIG, pure gold, and more. These surface finish options enhance the performance and durability of the PCB.   Applications The RO4725JXR PCB is commonly used in cellular base station antennas.

Introduction AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials designed to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. They are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets.This PTFE resin based material is compatible with standard PTFE fabrication and provides a cost-effective construction to improve electrical and mechanical performance.   Features The AD300D laminates demonstrate an outstanding passive intermodulation (PIM) value of -159 dBc at 30 mil and -163 dBc at 60 mil, measured with reflected 43 dBm swept tones at 1900 MHz. This low PIM performance enhances antenna efficiency and reduces yield loss due to PIM-related issues.   AD300D features controlled dielectric constant of 2.94 at 10 GHz, and low dissipation factor of 0.0021 at 10 GHz, 23°C, and 50% relative humidity.   Additionally, the thermal coefficient of the dielectric constant is measured at -73 ppm/°C across a temperature range of 0-100°C at 10 GHz, underscoring its stability under varying thermal conditions.   Boasting remarkable thermal resilience, AD300D surpasses a decomposition temperature (Td) exceeding 500°C.   Its coefficient of thermal expansion stands at 24 ppm/°C in the X-axis, 23 ppm/°C in the Y-axis, and 98 ppm/°C in the Z-axis within a temperature range of -55 to 288°C.   Furthermore, AD300D offers robust adhesion and durability, showcasing over 60 minutes of resistance to delamination at 288°C.   The material's moisture absorption rate is minimal, at just 0.04% under E1/105 + D48/50 conditions.   PCB Material: Ceramic-filled, glass-reinforced PTFE-based Composites Designation: AD300D Dielectric constant: 2.94 (10 GHz) Dissipation factor: 0.0021 (10 GHz) Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 120mil (3.048mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..   PCB Capability Our PCB manufacturing capabilities for AD300D encompass a wide range, including single-sided, double-sided, multi-layer, and hybrid PCBs.   You can select copper weight options of 1 oz (35 µm) or 2 oz (70 µm) based on your specific requirements. Dielectric thickness is available from 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), and 120mil (3.048mm).   With a maximum PCB size of 400 mm x 500 mm, we accommodate either a single board within these dimensions or multiple designs on a panel of the same size.   We offer a variety of solder mask options including Green, Black, Blue, Yellow, Red, and more to suit your preferences.   Furthermore, we provide an array of surface finish choices such as Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, ENEPIG, Bare Copper, and Pure Gold to cater to diverse needs and specifications.   Applications AD300D PCBs are versatile and well-suited for a diverse range of applications, including Cellular infrastructure base station antennas, Automotive telematics antenna systems and Commercial satellite radio antenna.

Introduction Rogers’ IsoClad 917 laminates utilize a minimal amount of non-woven fiberglass/PTFE to attain the lowest dielectric constant and dissipation factor in their category. The non-woven reinforcement enables these laminates to be suitable for applications where the final PCB might need to be bent, such as conformal or wrap-around antennas. IsoClad 917's unique longer random fibers and proprietary manufacturing process offer superior dimensional stability and uniformity of dielectric constant compared to competitors in similar categories.   Features The IsoClad 917 showcases a dielectric constant (Dk) of 2.17 or 2.20, offering precise performance with a tolerance of ±0.03 at 10 GHz.   In addition, the material boasts an impressively low dissipation factor of 0.0013 at the same frequency, ensuring minimal signal loss and enhanced signal integrity.   Its highly isotropic nature across the X, Y, and Z axes ensures uniform electrical performance and reliability in diverse applications.   Moreover, IsoClad 917 features a low moisture absorption rate of just 0.04%.   In addition to its superior electrical properties, IsoClad917 is less rigid than traditional woven fiberglass materials, offering enhanced flexibility.   PCB Material: Non-woven Fiberglass / PTFE Composites Designation: IsoClad 917 Dielectric constant: 2.17 or 2.20 (10 GHz) Dissipation factor: 0.0013 (10 GHz) Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB Copper weight: 1oz (35µm), 2oz (70µm) Dielectric thickness 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) PCB size: ≤400mm X 500mm Solder mask: Green, Black, Blue, Yellow, Red etc. Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..   PCB Capability Welcome to our introduction on PCB capabilities for IsoClad 917.   Our offerings encompass a wide range of configurations to meet diverse project requirements:   Layer Count: We support a variety of configurations, including Single Sided, Double Sided, Multi-layer PCBs, and Hybrid PCBs.   Copper Weight: Options are available for 1 oz (35 µm) and 2 oz (70 µm) copper weights to meet diverse electrical requirements.   Dielectric Thickness: We offer multiple dielectric thicknesses,such as 20 mil (0.508 mm), 31 mil (0.787 mm), and 62 mil (1.575 mm).   PCB Size: Our PCBs can be manufactured in sizes up to 400 mm x 500 mm, including one board or multiple designs in this size.   Solder Mask Options: We provide a range of solder mask colors, including Green, Black, Blue, Yellow, Red, and more.   Surface Finish: Various surface finishes are available, such as Immersion Gold, HASL, Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, and Pure Gold Plated.   Application IsoClad 917 PCBs are perfect for applications in conformal antennas, stripline and microstrip circuits, guidance systems, and radar systems. Its low loss, stable performance, and precise dielectric properties are essential for efficient signal transmission and reliable signal processing.