|
Product Details:
Payment & Shipping Terms:
|
| Material: | RT/duroid 5880LZ | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Size: | 90.63mm X 170.35 Mm=1PCS, +/- 0.15mm | PCB Thickness: | 20mil |
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | OSP |
| Highlight: | OSP Double-Sided Circuit PCB,20mil Double-Sided Circuit PCB,RT duroid 5880LZ PCB |
||
Introducing the RT/duroid 5880LZ PCB, a cutting-edge solution designed for high-performance applications requiring precision and reliability. Crafted from Rogers RT/duroid 5880LZ laminates, this PCB is engineered with filled PTFE composites ideal for strip-line and micro-strip circuit applications. With its unique filler composition, this laminate offers a lightweight, low-density material perfect for weight-sensitive environments.
Key Features
- Dielectric Constant (DK): 2.0 ± 0.04 at 10 GHz and 23°C
- Dissipation Factor: Ranges from 0.0021 to 0.0027 at 10 GHz and 23°C
- Low Z-Axis Coefficient of Thermal Expansion: 40 ppm/°C
- Outgassing Properties: TML 0.01%, CVCM 0.01%, WVR 0.01%
- Density: Lightweight at 1.4 gm/cm3
- Flammability Rating: UL 94V-0
- Lead-Free Process Compatibility: Ensures compliance with modern manufacturing standards
Benefits
- Lightweight Design: Reduces overall system weight without compromising performance.
- Uniform Electrical Properties: Maintains consistent performance across a wide frequency range.
- Chemical Resistance: Durable against solvents and reagents used in etching and plating processes.
| RT/duroid 5880 Typical Value | ||||||
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
| PCB Material: | Unique PTFE Composites |
| Designation: | RT/Duroid 5880LZ |
| Dielectric constant: | 2 |
| Dissipation Factor | 0.0021 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
The construction of this PCB is meticulously engineered. It comprises a 2-layer rigid stackup, featuring 35 μm of copper on both layers and a 0.508 mm (20 mil) core of RT/duroid 5880LZ. With precise dimensions of 90.63 mm x 170.35 mm (± 0.15 mm) and a finished thickness of 0.6 mm, this PCB accommodates minimum trace and space requirements of 4/5 mils, and a minimum hole size of 0.2 mm. The PCB is compatible with lead-free processes and adheres to UL 94V-0 flammability standards, ensuring both safety and environmental compliance.
The RT/duroid 5880LZ PCB is supplied with artwork in the Gerber RS-274-X format, ensuring compatibility with industry-standard design software for seamless integration into your projects. It adheres to the IPC-Class-2 quality standard, guaranteeing a reliable performance suitable for a wide range of applications. Additionally, this product is available worldwide, making it accessible to a global market of engineers seeking high-performance PCB solutions.
This PCB is versatile and suitable for a variety of advanced applications, including airborne antenna systems, lightweight feed networks, radar systems, guidance systems, and point-to-point digital radio antennas. With its impressive specifications and robust performance, the RT/duroid 5880LZ PCB stands out as a valuable asset for modern communication and defense technologies, meeting the high demands of contemporary electronic designs.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
